公开(公告)号：US20240150681A1

公开(公告)日：2024-05-09

申请号：US18487868

申请日：2023-10-16

Applicant: ENF TECHNOLOGY CO., LTD. ,  SK hynix Inc.

Inventor： Hye Ji KIM ,  JinHo YOU ,  Hag Sung LEE ,  MyungHo LEE ,  Narae YIM ,  Yu jin HEO ,  Keon young KIM ,  Yun sun CHOI ,  Young mee KANG

IPC: C11D7/32 ,  C11D1/00 ,  C11D3/16 ,  C11D7/26 ,  C11D7/28 ,  C11D7/50 ,  C11D11/00 ,  H01L21/02

CPC classification number: C11D7/3209 ,  C11D1/004 ,  C11D3/162 ,  C11D7/265 ,  C11D7/28 ,  C11D7/3281 ,  C11D7/5022 ,  C11D11/0047 ,  H01L21/02057

Abstract: The present disclosure relates to a cleaning agent composition for a substrate for a semiconductor device and a method for cleaning a substrate for a semiconductor device using the same. The cleaning agent composition contains a silicon-based compound represented by Formula 1 and an aprotic organic solvent with a dielectric constant of 10 or less, which can form a surface protective film capable of preventing collapse of the pattern even in a wet cleaning process of fine patterns with high aspect ratios, thereby providing a method for manufacturing a semiconductor device with an improved semiconductor manufacturing yield.

公开(公告)号：US20230017238A1

公开(公告)日：2023-01-19

申请号：US17844107

申请日：2022-06-20

Applicant: ENF TECHNOLOGY CO., LTD.

Inventor： Hye Ji KIM ,  Jin Ho YOU ,  Namgi CHO

IPC: C09K13/00 ,  C09K15/30 ,  G03F7/42

Abstract: The present invention relates to a stripper composition for removing a photoresist in a process of manufacturing a semiconductor device.
According to the present invention, it is possible to prevent corrosion of the underlying film while improving the peeling force for the photoresist, and to improve the stability of the composition over time.