公开(公告)号：US20240294856A1

公开(公告)日：2024-09-05

申请号：US18435661

申请日：2024-02-07

Applicant: Willis Electric Co., Ltd.

Inventor： Johnny CHEN

IPC: C11D7/50

CPC classification number: C11D7/5022 ,  C11D7/5018 ,  C11D2111/16

Abstract: A tangle-resistant decorative lighting assembly, comprising: a main portion including a plurality of wires and connectors, including first and second connectors and first and second lighted-extension portions extending transversely from the main portion. The first lighted extension portion including: a first connector configured to detachably connect to the first connector of the main portion, a first plurality of wires connected to the first connector, and a first plurality of lamp assemblies connected to the first plurality of wires. The second lighted-extension portion including: a second connector configured to detachably connect to the second connector of the main portion, a second plurality of wires connected to the second connector, and a second plurality of lamp assemblies connected to the second plurality of wires. The first connector of the main portion comprises a lock portion configured to engage with a lock portion of the first connector of the first lighted-extension portion.

公开(公告)号：US20240134284A1

公开(公告)日：2024-04-25

申请号：US18400807

申请日：2023-12-29

Applicant: FUJIFILM Corporation

Inventor： Tomonori TAKAHASHI ,  Tetsuya KAMIMURA

IPC: G03F7/42 ,  C11D3/00 ,  C11D7/04 ,  C11D7/20 ,  C11D7/26 ,  C11D7/32 ,  C11D7/34 ,  C11D7/50 ,  H01L21/02

CPC classification number: G03F7/425 ,  C11D3/0073 ,  C11D7/04 ,  C11D7/20 ,  C11D7/261 ,  C11D7/3209 ,  C11D7/3218 ,  C11D7/3227 ,  C11D7/3281 ,  C11D7/34 ,  C11D7/5004 ,  C11D7/5009 ,  C11D7/5022 ,  G03F7/423 ,  G03F7/426 ,  H01L21/02063 ,  H01L21/02068 ,  C11D2111/22

Abstract: A treatment liquid for a semiconductor device includes an alkanolamine; a hydroxylamine; an organic solvent; Ca; Fe; and Na, wherein the content of the alkanolamine in the treatment liquid is 0.1% to 5% by mass, the content of the hydroxylamine in the treatment liquid is 0.1% to 30% by mass, and each of the mass ratio of Ca, Fe, and Na with respect to the content of the alkanolamine and the hydroxylamine in the treatment liquid is 10−12 to 10−4.

公开(公告)号：US11807837B2

公开(公告)日：2023-11-07

申请号：US17269692

申请日：2019-09-26

Applicant: SHOWA DENKO K.K.

Inventor： Susumu Nakazaki ,  Kuniaki Miyahara ,  Tomoyuki Fukuyo

IPC: C11D7/50 ,  C11D7/32 ,  C11D11/00 ,  H01L21/02

CPC classification number: C11D7/3209 ,  C11D7/5013 ,  C11D7/5022 ,  C11D11/0047 ,  H01L21/02057

Abstract: Provided is a composition having high affinity for the surface of an adhesive, and excellent long-term storage stability. This composition comprises: a quaternary alkylammonium fluoride or a hydrate of a quaternary alkylammonium fluoride; and an aprotic solvent, wherein the aprotic solvent includes (A) an N-substituted amide compound having 4 or more carbon atoms and not containing active hydrogen on a nitrogen atom, and (B) an ether compound.

公开(公告)号：US20230295537A1

公开(公告)日：2023-09-21

申请号：US18117175

申请日：2023-03-03

Applicant: ENTEGRIS, INC.

Inventor： Jun Liu ,  Chao-Yu Wang ,  Daniela White ,  Michael L. White

IPC: C11D7/32 ,  C11D11/00 ,  C11D7/34 ,  C11D7/50 ,  H01L21/02

CPC classification number: C11D7/3218 ,  C11D11/0047 ,  C11D7/34 ,  C11D7/3272 ,  C11D7/5022 ,  H01L21/02074

Abstract: The invention provides compositions useful in post-CMP cleaning operations, particularly those substrates which contain exposed copper surfaces. The compositions of the invention provide excellent cleaning of such substrates while showing fewer defects from silica and organic materials present at the surface of the substrate. Also provided is a method for cleaning a microelectronic device substrate using such compositions and a kit comprising, in two or more containers, the components of the compositions.

公开(公告)号：US20230272257A1

公开(公告)日：2023-08-31

申请号：US17998994

申请日：2021-05-14

Applicant: BIOBASE SWEDEN AB

Inventor： Per WIKLUND

IPC: C09K5/20 ,  C09K3/18 ,  C11D7/50 ,  C11D7/26 ,  C11D11/00

CPC classification number: C09K5/20 ,  C09K3/185 ,  C11D7/5022 ,  C11D7/265 ,  C11D7/261 ,  C11D11/0035

Abstract: The invention relates to a fluid comprising or consisting of glycerol and potassium acetate in a weight ratio interval of 3:2 to 1:6 with a water content of 55-80 w %, wherein the combined weight of glycerol and potassium acetate constitutes 20-45 w %, up to a maximum or total of 100 w %. The inventive fluid is useful as a heat transfer fluid, a deicing fluid or a windscreen washing fluid. A method for producing the inventive fluid is also provided.

公开(公告)号：US11685838B2

公开(公告)日：2023-06-27

申请号：US16308027

申请日：2017-06-13

Applicant: SUN CHEMICAL CORPORATION

Inventor： Jerome Fox ,  Saeid Savarmand

IPC: C09D9/00 ,  B08B1/00 ,  B08B3/08 ,  B41F23/00 ,  C11D7/26 ,  C11D7/50 ,  C11D11/00 ,  C11D7/22 ,  C11D7/04 ,  C11D7/24

CPC classification number: C09D9/005 ,  B08B1/006 ,  B08B3/08 ,  B41F23/002 ,  C09D9/00 ,  C11D7/04 ,  C11D7/22 ,  C11D7/26 ,  C11D7/263 ,  C11D7/264 ,  C11D7/266 ,  C11D7/50 ,  C11D7/5022 ,  C11D11/0041 ,  C11D7/248 ,  C11D7/261

Abstract: The present invention provides cleaning solutions for removing ink, coating, varnish, adhesive, etc. residue from printing equipment. The cleaning solutions of the present invention comprise one or more solvents, preferably selected from acetoacetates, alcohols, glycol ethers, glycol esters, terpenes, and water, and are preferably free of surfactants. The cleaning solutions of the invention have a relative evaporation time (RET) of less than 60 seconds, and a ratio of the RET to the radius of the sphere of solubility of the resin in the ink to be removed of less than 6.

公开(公告)号：US20230151308A1

公开(公告)日：2023-05-18

申请号：US17913624

申请日：2021-03-22

Applicant: NISSAN CHEMICAL CORPORATION

Inventor： Takahisa OKUNO ,  Masaki YANAI ,  Takuya FUKUDA ,  Hiroto OGATA ,  Shunsuke MORIYA ,  Hiroshi OGINO ,  Tetsuya SHINJO

IPC: C11D11/00 ,  C11D7/50 ,  C09J5/00 ,  H01L21/02 ,  B08B3/08

CPC classification number: C11D11/0047 ,  C11D7/5022 ,  C11D7/5013 ,  C11D7/5009 ,  C09J5/00 ,  H01L21/02079 ,  B08B3/08 ,  C09J2483/00 ,  B08B2220/01

Abstract: The present invention provides a semiconductor substrate cleaning method including a step of removing an adhesive layer provided on a semiconductor substrate by use of a remover composition, wherein the remover composition contains a solvent but no salt; and the solvent includes an organic solvent represented by formula (L) (wherein each of L1 and L2 represents a C2 to C4 alkyl group, and L3 represents O or S) in an amount of 80 mass % or more.


L1-L3-L2(L)

公开(公告)号：US20190191695A1

公开(公告)日：2019-06-27

申请号：US16329033

申请日：2017-08-30

Applicant: OLEON NV

Inventor： Sophie DEPREY ,  Pierre RAVIER

IPC: A01N25/02 ,  C11D7/50

CPC classification number: A01N25/02 ,  A01N25/30 ,  A01N31/02 ,  A01N35/02 ,  C11D3/2093 ,  C11D3/3445 ,  C11D7/266 ,  C11D7/5009 ,  C11D7/5022

Abstract: A composition comprising: —at least 25% of a fatty acid methyl ester having from 6 to 14 carbon atoms, or a mixture of such methyl esters; —at least 15% of dimethyl sulfoxide, or DMSO; and —at least 5% of a glyceryl fatty acid monoester having from 6 to 14 carbon atoms or a mixture of such glyceryl monoesters; the percentages being percentages by weight relative to the total weight of the composition. This composition is stable at low temperature and may be used as a cleaning, dissolvent, dispersant and/or diluent composition, especially for active principles in the plant protections field.

公开(公告)号：US10072237B2

公开(公告)日：2018-09-11

申请号：US15227450

申请日：2016-08-03

Applicant: Air Products and Chemicals, Inc.

Inventor： Randy Li-Kai Chang ,  Gene Everad Parris ,  Hsiu Mei Chen ,  Yi-Chia Lee ,  Wen Dar Liu ,  Tianniu Chen ,  Laura M. Matz ,  Ryback Li Chang Lo ,  Ling-Jen Meng

IPC: C11D11/00 ,  H01L23/00 ,  C11D7/26 ,  C11D7/34 ,  C11D7/50 ,  C11D7/32 ,  C11D3/00 ,  G03F7/42 ,  H01L21/311

CPC classification number: C11D11/0047 ,  C11D3/0073 ,  C11D7/265 ,  C11D7/3209 ,  C11D7/34 ,  C11D7/5009 ,  C11D7/5013 ,  C11D7/5022 ,  G03F7/425 ,  G03F7/426 ,  H01L21/31133 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/94 ,  H01L2224/02311 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/03462 ,  H01L2224/0401 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05171 ,  H01L2224/05614 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/05672 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/1148 ,  H01L2224/1181 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/81191 ,  H01L2224/94 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/014 ,  H01L2224/11 ,  H01L2924/01047

Abstract: It is disclosed a photoresist cleaning composition for stripping a photoresist pattern having a film thickness of 3-150 μm, which contains (a) quaternary ammonium hydroxide (b) a mixture of water-soluble organic solvents (c) at least one corrosion inhibitor and (d) water, and a method for treating a substrate therewith.

公开(公告)号：US20180187315A1

公开(公告)日：2018-07-05

申请号：US15740013

申请日：2016-06-28

Applicant: SHELL OIL COMPANY

Inventor： Johannes Leendert Willem Cornelis DEN BOESTERT ,  Sanne WIJNANS

IPC: C23G5/032 ,  C11D11/00 ,  C11D7/50 ,  C07C68/06

CPC classification number: C23G5/032 ,  C07C68/06 ,  C07C69/96 ,  C11D7/266 ,  C11D7/5022 ,  C11D11/0041

Abstract: A process for degreasing a chemical plant is disclosed. The vessels and process lines are rinsed with a solvent comprising at least 50 wt % dialkyl carbonate, based upon the weight of the solvent.