METHOD FOR FORMING THIN FILM TRANSISTOR

    公开(公告)号:US20250120159A1

    公开(公告)日:2025-04-10

    申请号:US18887701

    申请日:2024-09-17

    Abstract: Provided is a thin film transistor including a substrate, a channel layer on the substrate, a first source/drain electrode and a second source/drain electrode spaced apart on the substrate and on the channel layer in a first direction parallel to the substrate, a gate insulation layer on the substrate, the channel layer, the first source/drain electrode, and the second source/drain electrode, and a gate electrode on the gate insulation layer between the first and second source/drain electrodes, wherein the uppermost level of the gate electrode is substantially the same as the uppermost level of the gate insulation layer.

    SEMICONDUCTOR DEVICE
    2.
    发明申请

    公开(公告)号:US20250118357A1

    公开(公告)日:2025-04-10

    申请号:US18892187

    申请日:2024-09-20

    Abstract: Provided is a semiconductor device including a substrate, a first transistor on the substrate, an interlayer insulating layer covering the first transistor, a second transistor on the interlayer insulating layer, and a storage node contact passing through the interlayer insulating layer, and connecting any one of source/drain electrodes of the first transistor and a gate electrode of the second transistor, wherein a first channel pattern of the first transistor may include an n-type oxide transistor, and a second channel pattern of the second transistor may include an p-type oxide transistor.

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