利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

6 条记录 (耗时 0.015 秒)

    CMOS LOGIC ELEMENT INCLUDING OXIDE SEMICONDUCTOR
    1.
    发明申请
    CMOS LOGIC ELEMENT INCLUDING OXIDE SEMICONDUCTOR 有权

    公开(公告)号：US20230097393A1

    公开(公告)日：2023-03-30

    申请号：US17520853

    申请日：2021-11-08

    申请人： Electronics and Telecommunications Research Institute

    发明人： Sung Haeng CHO ,  Byung-Do YANG ,  Sooji NAM ,  Jaehyun MOON ,  Jae-Eun PI ,  Jae-Min KIM

    IPC分类号： H01L27/092 ,  H01L29/24 ,  H03K19/0185 ,  H03K19/0948 ,  H01L27/02

    摘要： Provided is a Complementary Metal Oxide Semiconductor (CMOS) logic element. The CMOS logic element includes a substrate including a PMOS area, a circuit wiring structure including an insulating layer and a wiring layer alternately stacked on the substrate, wherein the circuit wiring structure includes an NMOS area vertically spaced apart from the PMOS area, a first transistor disposed on the PMOS area, and a second transistor disposed on the NMOS area and complementarily connected to the first transistor, wherein the first transistor includes a first gate electrode, source/drain areas formed on the PMOS area on both sides of the first gate electrode, and a first channel connecting the source and drain areas to each other, wherein the second transistor includes a second gate electrode and a second channel vertically overlapping the second gate electrode, wherein the first channel includes silicon, wherein the second channel includes an oxide semiconductor.

    SRAM DEVICE INCLUDING OXIDE SEMICONDUCTOR
    6.
    发明申请
    SRAM DEVICE INCLUDING OXIDE SEMICONDUCTOR 有权

    公开(公告)号：US20230102625A1

    公开(公告)日：2023-03-30

    申请号：US17529817

    申请日：2021-11-18

    申请人： Electronics and Telecommunications Research Institute

    发明人： Sung Haeng CHO ,  Byung-Do YANG ,  Sooji NAM ,  Jaehyun MOON ,  Jae-Eun PI ,  Jae-Min KIM

    IPC分类号： H01L27/11 ,  G11C11/412 ,  G11C11/417

    摘要： Provided is a static random-access memory (SRAM) device. The SRAM device includes a substrate including a PMOS area, a circuit wiring structure including an insulating layer and a wiring layer alternately stacked on the substrate, wherein the circuit wiring structure includes a first NMOS area and a second NMOS area vertically separated from the PMOS area with the first NMOS area therebetween, a first transistor including a first gate electrode disposed on the PMOS area, source/drain areas formed on the PMOS area on both sides of the first gate electrode, and a first channel connecting the source and drain areas to each other, a second transistor including a second gate electrode disposed in the first NMOS area and a second channel vertically overlapping the second gate electrode, and a third transistor including a third gate electrode disposed in the second NMOS area and a third channel vertically overlapping the third gate electrode, wherein the first channel includes silicon, wherein the second channel and the third channel include an oxide semiconductor.