公开(公告)号：US20140076610A1

公开(公告)日：2014-03-20

申请号：US13934635

申请日：2013-07-03

Applicant: Electronics and Telecommunications Research Institute

Inventor： Yong Suk YANG ,  In-Kyu You ,  Minseok Kim ,  Soon-Won Jung ,  Bock Soon Na ,  Sang Chul Lim

IPC: H05K1/02 ,  H05K3/00

CPC classification number: H05K1/02 ,  H01L51/0022 ,  H01L51/003 ,  H01L51/102 ,  H01L51/441 ,  H01L51/5203 ,  H05K1/0393 ,  H05K3/0058 ,  H05K3/207 ,  H05K2201/0376

Abstract: Disclosed are a method for manufacturing a planarizing printed electronic device and a planarizing printed electronic device manufactured by using the same by simply implementing a large-area embedded printed electronic device by coupling a printing process such as inkjet printing and gravure printing and a transferring process using a laminating device and particularly, solving defects due to large surface roughness and a thickness of a printed layer included in the printed electronic device, when manufacturing an embedded printed electronic device where a printed layer is embedded in a substrate.

Abstract translation: 公开了一种制造平面印刷电子器件的方法和通过使用它们简单地实现大面积嵌入式印刷电子器件而制造的平面化印刷电子器件，其通过联接诸如喷墨印刷和凹版印刷的印刷工艺和使用 层压装置，特别是在制造嵌入印刷电子器件时，其中印刷层嵌入基板中，特别是解决了印刷电子器件中包括的印刷层的大的表面粗糙度和厚度的缺陷。

公开(公告)号：US09345123B2

公开(公告)日：2016-05-17

申请号：US13934635

申请日：2013-07-03

Applicant: Electronics and Telecommunications Research Institute

Inventor： Yong Suk Yang ,  In-Kyu You ,  Minseok Kim ,  Soon-Won Jung ,  Bock Soon Na ,  Sang Chul Lim

IPC: H05K3/02 ,  H05K3/10 ,  H05K1/02 ,  H05K3/00 ,  H05K3/20 ,  H01L51/00 ,  H05K1/03 ,  H01L51/10 ,  H01L51/44 ,  H01L51/52

CPC classification number: H05K1/02 ,  H01L51/0022 ,  H01L51/003 ,  H01L51/102 ,  H01L51/441 ,  H01L51/5203 ,  H05K1/0393 ,  H05K3/0058 ,  H05K3/207 ,  H05K2201/0376

Abstract: A method for manufacturing a planarized printed electronic device includes performing a surface treatment on a base substrate to provide a surface treated base substrate and facilitate release during a delamination process; printing a layer having an electrode pattern onto the surface-treated base substrate; forming an organic material layer comprised of an organic material on the base substrate on which the printed layer is printed such that the printed layer is embedded therein to provide an embedded layer; providing a target substrate onto which the embedded layer is to be transferred; laminating by sandwiching the embedded layer between the base substrate on which the embedded layer is formed and the target substrate; delaminating by detaching the embedded layer from the base substrate; and transferring the printed layer onto the target substrate to provide a planarized printed layer. Large areas with reduced defects due to surface roughness are possible.

Abstract translation: 制造平面化印刷电子器件的方法包括在基底基板上进行表面处理以提供经表面处理的基底基板，并在分层过程中促进释放; 将具有电极图案的层印刷到经表面处理的基底上; 在所述基底基板上形成有机材料层，所述有机材料层在所述基底基板上印刷所述印刷层，使得所述印刷层嵌入其中以提供嵌入层; 提供要在其上传输嵌入层的目标衬底; 通过将嵌入层夹在其上形成有嵌入层的基底基板与靶基板之间进行层压; 通过从基底衬底分离嵌入层来分层; 并将印刷层转印到目标衬底上以提供平坦化的印刷层。 由于表面粗糙度而导致缺陷减少的大面积是可能的。