公开(公告)号：US20190377141A1

公开(公告)日：2019-12-12

申请号：US16007855

申请日：2018-06-13

Applicant: FINISAR CORPORATION

Inventor： Tao CHEN ,  Cheng Jie Dong ,  Jin Jiang ,  Ting Shi ,  Shao Jun Yu ,  You Ji Liu

IPC: G02B6/42 ,  H05K3/00 ,  H05K3/30 ,  H05K3/34

Abstract: The present disclosure generally relates to printed circuit boards or printed circuit board assemblies for fiber optic communications. In one example, a method may include coupling at least one optoelectronic component to a surface of a printed circuit board. The method may include lasering the surface of the printed circuit board to form a laser-roughened area on the surface of the printed circuit board. The method may include coupling an optical component to the printed circuit board at the laser-roughened area on the surface of the printed circuit board.