公开(公告)号：US20200371301A1

公开(公告)日：2020-11-26

申请号：US16993846

申请日：2020-08-14

Applicant: FINISAR CORPORATION

Inventor： Tao Chen ,  Cheng Jie Dong ,  Jin Jiang ,  Ting Shi ,  Shao Jun Yu ,  You Ji Liu

IPC: G02B6/42 ,  H05K3/00 ,  H05K3/34 ,  H05K3/30

Abstract: The present disclosure generally relates to printed circuit boards or printed circuit board assemblies for fiber optic communications. In one example, an optoelectronic assembly may include a printed circuit board including a laser-roughened area, at least one optoelectronic component coupled to a surface of the printed circuit board, and an optical component attached to the printed circuit board. The coupling area may be defined by the optical component contacting the printed circuit board, and the laser-roughened area may be positioned entirely within the coupling area defined by the optical component contacting the printed circuit board.

公开(公告)号：US11555973B2

公开(公告)日：2023-01-17

申请号：US16993846

申请日：2020-08-14

Applicant: FINISAR CORPORATION

Inventor： Tao Chen ,  Cheng Jie Dong ,  Jin Jiang ,  Ting Shi ,  Shao Jun Yu ,  You Ji Liu

IPC: G02B6/42 ,  H05K3/00 ,  H05K3/34 ,  H05K3/30

Abstract: The present disclosure generally relates to printed circuit boards or printed circuit board assemblies for fiber optic communications. In one example, an optoelectronic assembly may include a printed circuit board including a laser-roughened area, at least one optoelectronic component coupled to a surface of the printed circuit board, and an optical component attached to the printed circuit board. The coupling area may be defined by the optical component contacting the printed circuit board, and the laser-roughened area may be positioned entirely within the coupling area defined by the optical component contacting the printed circuit board.

公开(公告)号：US11320611B2

公开(公告)日：2022-05-03

申请号：US16859752

申请日：2020-04-27

Applicant: FINISAR CORPORATION

Inventor： Qing Qian ,  Wei Li ,  Hui Juan Yan ,  Hui Yang ,  Wei Peng Nian ,  Ting Shi

IPC: G02B6/42 ,  H05K1/18 ,  H05K1/02

Abstract: The present disclosure generally relates to printed circuit boards or printed circuit board assemblies for fiber optic communications. In one non-limiting embodiment, a method of assembling an optoelectronic assembly includes providing a printed circuit board with a first metal coating and an optical component with a second metal coating. The method further includes positioning the optical component relative to the printed circuit board with at least some portion of the first metal coating aligned with or adjacent to at least some portion of the second metal coating, and applying solder between the first metal coating and the second metal coating to couple the optical component and the printed circuit board.

公开(公告)号：US11139412B2

公开(公告)日：2021-10-05

申请号：US16419950

申请日：2019-05-22

Applicant: FINISAR CORPORATION

Inventor： Tao Sun ,  Feng Wang ,  Wei Peng Nian ,  Ting Shi ,  Bing Qiu ,  Shao Jun Yu

IPC: H01L31/12 ,  H01L23/00 ,  G02B6/42

Abstract: In one example embodiment, a PCBA, an optoelectronic module, an electrical coupling, and/or a high speed interconnect may include a first contact pad, a second contact pad adjacent to and spaced apart from the first contact pad, a first wire coupled to the first contact pad via a first ball bump, and a second wire coupled to the second contact pad via a double ball bump.

公开(公告)号：US20210173158A1

公开(公告)日：2021-06-10

申请号：US16859752

申请日：2020-04-27

Applicant: FINISAR CORPORATION

Inventor： Qing Qian ,  Wei Li ,  Hui Juan Yan ,  Hui Yang ,  Wei Peng Nian ,  Ting Shi

IPC: G02B6/42 ,  H05K1/02 ,  H05K1/18

Abstract: The present disclosure generally relates to printed circuit boards or printed circuit board assemblies for fiber optic communications. In one non-limiting embodiment, a method of assembling an optoelectronic assembly includes providing a printed circuit board with a first metal coating and an optical component with a second metal coating. The method further includes positioning the optical component relative to the printed circuit board with at least some portion of the first metal coating aligned with or adjacent to at least some portion of the second metal coating, and applying solder between the first metal coating and the second metal coating to couple the optical component and the printed circuit board.

公开(公告)号：US10816741B2

公开(公告)日：2020-10-27

申请号：US16007855

申请日：2018-06-13

Applicant: FINISAR CORPORATION

Inventor： Tao Chen ,  Cheng Jie Dong ,  Jin Jiang ,  Ting Shi ,  Shao Jun Yu ,  You Ji Liu

IPC: G02B6/42 ,  H05K3/00 ,  H05K3/34 ,  H05K3/30

Abstract: The present disclosure generally relates to printed circuit boards or printed circuit board assemblies for fiber optic communications. In one example, a method may include coupling at least one optoelectronic component to a surface of a printed circuit board. The method may include lasering the surface of the printed circuit board to form a laser-roughened area on the surface of the printed circuit board. The method may include coupling an optical component to the printed circuit board at the laser-roughened area on the surface of the printed circuit board.

公开(公告)号：US20190377141A1

公开(公告)日：2019-12-12

申请号：US16007855

申请日：2018-06-13

Applicant: FINISAR CORPORATION

Inventor： Tao CHEN ,  Cheng Jie Dong ,  Jin Jiang ,  Ting Shi ,  Shao Jun Yu ,  You Ji Liu

IPC: G02B6/42 ,  H05K3/00 ,  H05K3/30 ,  H05K3/34

Abstract: The present disclosure generally relates to printed circuit boards or printed circuit board assemblies for fiber optic communications. In one example, a method may include coupling at least one optoelectronic component to a surface of a printed circuit board. The method may include lasering the surface of the printed circuit board to form a laser-roughened area on the surface of the printed circuit board. The method may include coupling an optical component to the printed circuit board at the laser-roughened area on the surface of the printed circuit board.