Methods and systems for interconnecting parallel IGBT modules

    公开(公告)号:US09762146B2

    公开(公告)日:2017-09-12

    申请号:US14929173

    申请日:2015-10-30

    CPC classification number: H02M7/537 H02M7/493 H03K17/0828 H03K2017/0806

    Abstract: A system for interconnecting parallel insulated gate bipolar transistor (IGBT) modules is provided. A pair of switches selected from a plurality of the IGBT modules are assigned to a driver integrated circuit (IC). In the pair of switches, a master IGBT switch is selected, the other switch being a slave IGBT switch. A command signal from the driver IC is electrically coupled to both the master and slave IGBT switches. The master and slave IGBT switches both have protective circuits; however, the driver IC is electrically coupled to the protective circuits of the selected master IGBT switch only. The protective circuits include temperature and current sense circuits. The plurality of the IGBT modules may be formed by two hexpack power modules. The modules are configured such that only a single driver IC is needed for each pair of parallel IGBT switches, with equal current sharing of the paralleled modules.

    Methods and Systems for Interconnecting Parallel IGBT Modules

    公开(公告)号:US20170126145A1

    公开(公告)日:2017-05-04

    申请号:US14929173

    申请日:2015-10-30

    CPC classification number: H02M7/537 H02M7/493 H03K17/0828 H03K2017/0806

    Abstract: A system for interconnecting parallel insulated gate bipolar transistor (IGBT) modules is provided. A pair of switches selected from a plurality of the IGBT modules are assigned to a driver integrated circuit (IC). In the pair of switches, a master IGBT switch is selected, the other switch being a slave IGBT switch. A command signal from the driver IC is electrically coupled to both the master and slave IGBT switches. The master and slave IGBT switches both have protective circuits; however, the driver IC is electrically coupled to the protective circuits of the selected master IGBT switch only. The protective circuits include temperature and current sense circuits. The plurality of the IGBT modules may be formed by two hexpack power modules. The modules are configured such that only a single driver IC is needed for each pair of parallel IGBT switches, with equal current sharing of the paralleled modules.

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