公开(公告)号：US09689915B2

公开(公告)日：2017-06-27

申请号：US14274889

申请日：2014-05-12

Applicant: FormFactor, Inc.

Inventor： Toshihiro Kasai ,  Masanori Watanabe ,  Yoichi Urakawa

IPC: G01R31/00 ,  G01R31/28

CPC classification number: G01R31/2887 ,  Y10T29/49117

Abstract: A probe card apparatus can comprise a tester interface to a test controller, probes for contacting terminals of electronic devices to be tested, and electrical connections there between. The probe card apparatus can comprise a primary sub-assembly, which can include the tester interface. The probe card apparatus can also comprise an interchangeable probe head, which can include the probes. The interchangeable probe head can be attached to and detached from the primary sub-assembly while the primary sub-assembly is secured to or in a housing of a test system. Different probe heads each having probes disposed in different patterns to test different types of electronic devices can thus be interchanged while the primary sub-assembly is secured to or in a housing of the test system.

公开(公告)号：US20140340103A1

公开(公告)日：2014-11-20

申请号：US14274889

申请日：2014-05-12

Applicant: FormFactor, Inc.

Inventor： Toshihiro Kasai ,  Masanori Watanabe

IPC: G01R1/067

CPC classification number: G01R31/2887 ,  Y10T29/49117

Abstract: A probe card apparatus can comprise a tester interface to a test controller, probes for contacting terminals of electronic devices to be tested, and electrical connections there between. The probe card apparatus can comprise a primary sub-assembly, which can include the tester interface. The probe card apparatus can also comprise an interchangeable probe head, which can include the probes. The interchangeable probe head can be attached to and detached from the primary sub-assembly while the primary sub-assembly is secured to or in a housing of a test system. Different probe heads each having probes disposed in different patterns to test different types of electronic devices can thus be interchanged while the primary sub-assembly is secured to or in a housing of the test system.

Abstract translation: 探针卡装置可以包括到测试控制器的测试器接口，用于接触要测试的电子设备的端子的探针以及其间的电连接。 探针卡装置可以包括主要子组件，其可以包括测试器接口。 探针卡装置还可以包括可互换探针头，其可以包括探针。 可互换探针头可以连接到主子组件并从主子组件拆卸，同时将主子组件固定到测试系统的壳体或壳体中。 因此，可以将主要子组件固定到测试系统的壳体中或其中的每个具有以不同图案设置的探针以测试不同类型的电子设备的不同探针头。

公开(公告)号：US10578649B2

公开(公告)日：2020-03-03

申请号：US16116317

申请日：2018-08-29

Applicant: FormFactor, Inc.

Inventor： Benjamin N. Eldridge ,  Masanori Watanabe ,  Scott Kuhnert ,  Jeffrey Coussens

IPC: G01R1/073

Abstract: Vertical probe heads having a space transformer laterally tiled into several sections are provided. This change relative to conventional approaches improves manufacturing yield. These probe heads can include metal ground planes, and in embodiments where the ground planes are provided as separate metal plates parallel to the guide plates, the metal plates can also be laterally tiled into several sections. Such tiling of metal plates improves manufacturing yield and alleviates thermal mismatch issues. Probes are not mechanically connected to the space transformer, which facilitates replacement of individual probes of an array.

公开(公告)号：US20190064220A1

公开(公告)日：2019-02-28

申请号：US16116317

申请日：2018-08-29

Applicant: FormFactor, Inc.

Inventor： Benjamin N. Eldridge ,  Masanori Watanabe ,  Scott Kuhnert ,  Jeffrey Coussens

IPC: G01R1/073

Abstract: Vertical probe heads having a space transformer laterally tiled into several sections are provided. This change relative to conventional approaches improves manufacturing yield. These probe heads can include metal ground planes, and in embodiments where the ground planes are provided as separate metal plates parallel to the guide plates, the metal plates can also be laterally tiled into several sections. Such tiling of metal plates improves manufacturing yield and alleviates thermal mismatch issues. Probes are not mechanically connected to the space transformer, which facilitates replacement of individual probes of an array.

公开(公告)号：US20250020689A1

公开(公告)日：2025-01-16

申请号：US18762393

申请日：2024-07-02

Applicant: FormFactor, Inc.

Inventor： Choon Beng Sia ,  Yoichi Funatoko ,  Isao Kunioka ,  Masanori Watanabe ,  Peter Andrews ,  Ken Dawson

IPC: G01R1/067 ,  G01R31/28

Abstract: Probes, probe blades, tools for probe blades, blade holders, and probe systems for electrically testing a device under test (DUT). In some examples, the probe blades are configured to provide a Kelvin electrical connection with the DUT. In some examples, the probe blades include an alignment structure configured to engage with a blade holder when the probe blade is received within a blade-receiving region of the blade holder. The blade holders are configured to separably and operatively attach a probe blade to a probe system. In some examples, the blade holders include the probe blade. The probe systems are configured to electrically test the DUT and include the blade holder.