Process for continuous polymer-analogous reactions
    1.
    发明授权
    Process for continuous polymer-analogous reactions 失效
    连续聚合物 - 类似反应的方法

    公开(公告)号:US06350824B1

    公开(公告)日:2002-02-26

    申请号:US09290214

    申请日:1999-04-13

    IPC分类号: C08L8305

    CPC分类号: C08G77/38 C08G77/46

    摘要: A continuous process for the polymer-analogous reaction of polymers bearing functional groups with reactive compounds, wherein in a first step, a mixture is prepared from the polymers bearing functional groups and the reactive compounds, and in a second step, the mixture is conducted continuously through a reaction zone and brought to reaction there.

    摘要翻译: 具有官能团的聚合物与反应性化合物的聚合物 - 类似反应的连续方法,其中在第一步中,由具有官能团的聚合物和反应性化合物制备混合物,在第二步中,连续进行混合 通过反应区并在那里进行反应。

    Process and apparatus for abrasive machining of a wafer-like workpiece
    3.
    发明授权
    Process and apparatus for abrasive machining of a wafer-like workpiece 失效
    晶片状工件的研磨加工工艺及装置

    公开(公告)号:US4739589A

    公开(公告)日:1988-04-26

    申请号:US881108

    申请日:1986-07-02

    IPC分类号: B24B37/08 B24B7/22

    CPC分类号: B24B37/08

    摘要: A process is provided for bilateral abrasive machining of wafer-like workpieces, especially semiconductor wafers. The process uses carrier disks in which the outer periphery on which the driving forces mesh, is made of a material having a tensile strength of at least 100 N/mm.sup.2, while in the area that comes into contact with the workpieces to be machined, there is provided a plastic material having an elasticity modulus of from 1.0 to 8.10.sup.4 N/mm.sup.2.

    摘要翻译: 提供了用于对晶片状工件,特别是半导体晶片进行双边研磨加工的工艺。 该过程使用承载盘,其中驱动力啮合的外周由抗拉强度为至少100N / mm2的材料制成,而在与要加工的工件接触的区域中 提供弹性模量为1.0至8.104N / mm 2的塑料材料。