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公开(公告)号:US06350824B1
公开(公告)日:2002-02-26
申请号:US09290214
申请日:1999-04-13
IPC分类号: C08L8305
摘要: A continuous process for the polymer-analogous reaction of polymers bearing functional groups with reactive compounds, wherein in a first step, a mixture is prepared from the polymers bearing functional groups and the reactive compounds, and in a second step, the mixture is conducted continuously through a reaction zone and brought to reaction there.
摘要翻译: 具有官能团的聚合物与反应性化合物的聚合物 - 类似反应的连续方法,其中在第一步中,由具有官能团的聚合物和反应性化合物制备混合物,在第二步中,连续进行混合 通过反应区并在那里进行反应。
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公开(公告)号:US06348557B1
公开(公告)日:2002-02-19
申请号:US09214042
申请日:1998-12-23
申请人: Herbert Barthel , August Altenbuchner , Johann Schuster , Mario Heinemann , Lutz Eismann , Otto Rothenaicher
发明人: Herbert Barthel , August Altenbuchner , Johann Schuster , Mario Heinemann , Lutz Eismann , Otto Rothenaicher
IPC分类号: C08G7704
CPC分类号: C09K3/1018 , C08G77/045 , C08G77/12 , C08G77/16 , C08G77/18 , C08G77/20 , C08G77/24 , C08K3/36 , C08K5/54 , C08L83/04 , C08L2666/44 , C08L83/00
摘要: The invention relates to crosslinkable materials based on organopolysiloxanes. Said materials are characterized in that in addition to organopolysiloxanes they contain at least one low-molecular organosilicon compound with 2 to 17 silicon atoms comprising units of the formula (I) R1aR2b(OR3)cSiO4−(a+b+c)/2, R1, R2, R3, a, b and c having the meaning given in claim 1 provided that low-molecular organosilicon compounds comprising units of the formula (I) where b is 0 have at least one unit of the formula (I) in which a is 0 or 1, and at least one unit of the formula (I) in which a is 3.
摘要翻译: 本发明涉及基于有机聚硅氧烷的可交联材料。 所述材料的特征在于,除了有机聚硅氧烷之外,它们还含有至少一种具有2至17个硅原子的低分子有机硅化合物,其包含式(I)R1aR2b(OR3)cSiO4-(a + b + c)/ 2的单元, 具有权利要求1中给出的含义的R1,R2,R3,a,b和c提供了包含式(I)单元的低分子有机硅化合物,其中b为0,具有至少一个式(I)单元,其中 a为0或1,以及其中a为3的式(I)的至少一个单元。
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公开(公告)号:US4739589A
公开(公告)日:1988-04-26
申请号:US881108
申请日:1986-07-02
CPC分类号: B24B37/08
摘要: A process is provided for bilateral abrasive machining of wafer-like workpieces, especially semiconductor wafers. The process uses carrier disks in which the outer periphery on which the driving forces mesh, is made of a material having a tensile strength of at least 100 N/mm.sup.2, while in the area that comes into contact with the workpieces to be machined, there is provided a plastic material having an elasticity modulus of from 1.0 to 8.10.sup.4 N/mm.sup.2.
摘要翻译: 提供了用于对晶片状工件,特别是半导体晶片进行双边研磨加工的工艺。 该过程使用承载盘,其中驱动力啮合的外周由抗拉强度为至少100N / mm2的材料制成,而在与要加工的工件接触的区域中 提供弹性模量为1.0至8.104N / mm 2的塑料材料。
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公开(公告)号:US6022921A
公开(公告)日:2000-02-08
申请号:US186323
申请日:1998-11-04
IPC分类号: C09K3/10 , C08F283/12 , C08J7/06 , C08K5/01 , C08K5/10 , C08K5/353 , C08K9/12 , C08L83/04 , C08L83/05 , C08L83/07 , C08G77/08 , C08L83/06
CPC分类号: C08J7/065 , C08K9/12 , C08L83/04 , C08G77/20 , C08J2383/04
摘要: The mechanical properties of addition-crosslinked silicone rubber are improved when the silicone rubber is brought into contact with a compound (A) having at least one aliphatically unsaturated multiple bond. In particular, the compression set is lowered.
摘要翻译: 当硅橡胶与具有至少一个脂族不饱和多键的化合物(A)接触时,加成交联硅橡胶的机械性能得到改善。 特别地,压缩永久变形被降低。
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