公开(公告)号：US20150056469A1

公开(公告)日：2015-02-26

申请号：US14526731

申请日：2014-10-29

Applicant: GENERAL ELECTRIC COMPANY

Inventor： Yan CUI ,  Srikanth Chandrudu KOTTILINGAM ,  Daniel James DORRIETY ,  Brian Lee TOLLISON ,  Dechao LIN ,  Hai Buu SAM

IPC: B23K35/30 ,  B23K35/02

CPC classification number: B23K35/304 ,  B23K9/044 ,  B23K9/235 ,  B23K10/027 ,  B23K26/32 ,  B23K26/342 ,  B23K26/60 ,  B23K35/0255 ,  B23K35/3033 ,  B23K2101/001 ,  B23K2103/26 ,  B23K2103/50 ,  C22C19/056 ,  C22C19/057 ,  Y10T428/12493 ,  Y10T428/12944

Abstract: A method of fabricating a component and a fabricated component are disclosed. The method includes depositing a material to a component and manipulating the material to form a boundary region and a filler region for desired properties. The component includes the boundary region and the filler region, thereby having the desired properties.

Abstract translation: 公开了一种制造部件和制造部件的方法。 该方法包括将材料沉积到组件并操纵材料以形成用于所需性质的边界区域和填充区域。 该组分包括边界区域和填料区域，从而具有所需的性质。