Abstract:
An electrical system includes a power electronics system and a bus bar coupled to the power electronic system. The power electronics system includes a switching device configured to selectively connect and disconnect. The bus bar includes a first conductive layer and a second conductive layer. The first conductive layer is disposed directly adjacent a first insulation layer, wherein the first conductive layer is configured to conduct a first polarity of electrical power to, from, or both the power electronics system. The second conductive layer is disposed directly adjacent the first insulation layer, and is configured to conduct a second polarity of electrical power opposite the first polarity to, from, or both the power electronics system. The first conductive layer comprises a first thickness half a second thickness of the second conductive layer.
Abstract:
An electrical component includes a magnetic core, an insulator, and a first winding. The insulator includes a first aperture disposed about a first portion of the core and a first insulator passage extending through the insulator, encircling the first aperture. The first winding extends through the first insulator passage and conducts an electrical current.
Abstract:
An electronic module is presented. The electronic module includes one or more electronic devices and a first bus electrically coupled to at least one of the one or more electronic devices. The first bus includes a first electrically conductive plate, a second electrically conductive plate, and a first electrically insulating plate disposed between the first electrically conductive plate and the second electrically conductive plate, where in a first portion of the first bus, the first electrically insulating plate is disposed such that the first electrically insulating plate is not in direct physical contact with at least one of the first electrically conductive plate and the second electrically conductive plate to form at least one cavity between the first electrically insulating plate and at least one of the first electrically conductive plate and the second electrically conductive plate. An electronic module assembly having low loop inductance is also presented.
Abstract:
A micro-inverter assembly includes a housing having an opening formed in a bottom surface thereof, and a direct current (DC)-to-alternating current (AC) micro-inverter disposed within the housing at a position adjacent to the opening. The micro-inverter assembly further includes a micro-inverter DC connector electrically coupled to the DC-to-AC micro-inverter and positioned within the opening of the housing, the micro-inverter DC connector having a plurality of exposed electrical contacts.
Abstract:
A rotor assembly that includes at least one integral non-magnetic rotor retaining structure comprising a plurality of individual rotor retaining discs, the discs having predefined slots; and a plurality of magnetic segments retained within the slots of the discs of the respective integral non-magnetic rotor retaining structure.
Abstract:
A heat sink for cooling an electronic component includes a substrate comprising an electrically non-conductive material and an inlet port and an outlet port extending outward from the substrate. The inlet and outlet ports are fluidically coupled to a fluid flow surface of the heat sink by passages that extend through a portion of the substrate. The heat sink also includes a shield comprising an electrically conductive material. The shield is disposed atop or within the substrate and is configured to suppress electromagnetic interference generated by an electronic component coupled to the heat sink.
Abstract:
A system and method for a microinverter mounting assembly including a microinverter assembly and a panel direct current (DC) connector. The microinverter assembly having a housing, a microinverter disposed within the housing, and a microinverter DC connector disposed within the housing and electrically coupled to the microinverter, the microinverter DC connector with a bottom panel having a locking recess formed therein and at least one electrical contact disposed within an opening formed in the bottom panel. The panel DC connector having a mounting substrate, a locking tab extending from the mounting substrate, and at least one electrical contact positioned on the mounting substrate. Further, the locking tab of the panel DC connector interfits within the locking recess of the microinverter DC connector to form a locking mechanism that prevents rotation of the microinverter DC connector when in a locked position.
Abstract:
A switch assembly includes one or more solid state semiconductor switches configured to be disposed within a downhole pipe assembly. The one or more switches are configured to operate in a closed state to conduct electric current supplied by a power source disposed above a surface to pumps disposed beneath the surface to cause the pumps to extract a resource from beneath the surface via the pipe assembly. The one or more switches also are configured to operate in an open state to stop conducting the electric current from the power source to the pumps.
Abstract:
A system and method for a photovoltaic (PV) module is disclosed that includes a microinverter assembly having a housing disposed on an inactive surface of a PV panel and a microinverter disposed within the housing. The PV module also includes a mounting bracket having a central bracket portion coupled to a frame of the PV panel, a first extension portion extending from the central bracket portion and coupled to the housing, a second extension portion extending from the central bracket portion and positioned on the inactive side of the PV panel, and a third extension portion located above the second extension portion and extending from the central bracket portion. At least one of the second and third extension portions is in contact with an inner wall of the frame of the PV panel.
Abstract:
A micro-inverter assembly includes a housing having an opening formed in a bottom surface thereof, and a direct current (DC)-to-alternating current (AC) micro-inverter disposed within the housing at a position adjacent to the opening. The micro-inverter assembly further includes a micro-inverter DC connector electrically coupled to the DC-to-AC micro-inverter and positioned within the opening of the housing, the micro-inverter DC connector having a plurality of exposed electrical contacts.