-
公开(公告)号：US20180116065A1
公开(公告)日：2018-04-26
申请号：US15662741
申请日：2017-07-28
Applicant: General Electric Company
Inventor： Tobias Schuetz , Xiaoting Dong , Philipp Leuner
CPC classification number: H05K7/1457 , H02M1/44 , H02M7/003 , H05K7/1432 , H05K9/002
Abstract: A shielded direct current link (“DC link”) busbar includes a central planar element that includes a first surface and a second surface axially opposed to the first surface. The shielded DC link busbar further includes a first conductive lamina disposed over the first surface and a second conductive lamina disposed over the second surface. Further, the first conductive lamina and the second conductive lamina are electrically coupled.
-
Patent Agency Ranking
公开(公告)号：US20180084661A1
公开(公告)日：2018-03-22
申请号：US15268653
申请日：2016-09-19
Applicant: General Electric Company
Inventor： Tobias Schuetz , Philip Michael Cioffi
CPC classification number: H05K7/026 , H01L23/485 , H01L24/49 , H01L25/071 , H02B1/205 , H02M7/003 , H05K7/1432
Abstract: An electronic module is presented. The electronic module includes one or more electronic devices and a first bus electrically coupled to at least one of the one or more electronic devices. The first bus includes a first electrically conductive plate, a second electrically conductive plate, and a first electrically insulating plate disposed between the first electrically conductive plate and the second electrically conductive plate, where in a first portion of the first bus, the first electrically insulating plate is disposed such that the first electrically insulating plate is not in direct physical contact with at least one of the first electrically conductive plate and the second electrically conductive plate to form at least one cavity between the first electrically insulating plate and at least one of the first electrically conductive plate and the second electrically conductive plate. An electronic module assembly having low loop inductance is also presented.
-
公开(公告)号：US10463863B2
公开(公告)日：2019-11-05
申请号：US15662808
申请日：2017-07-28
Applicant: General Electric Company
Inventor： Tobias Schuetz , Robert Roesner
IPC: G01V3/00 , A61N1/375 , H01B7/08 , H01B17/28 , H01B17/38 , H01B17/50 , H02G3/22 , H01G4/35 , H05K1/02
Abstract: A feedthrough includes a first printed circuit board, a first flexible conductive element coupled to and extending from an edge of the first printed circuit board, a second printed circuit board, and a second flexible conductive element coupled to and extending from an edge of the second printed circuit board.
-
公开(公告)号：US20180117342A1
公开(公告)日：2018-05-03
申请号：US15662808
申请日：2017-07-28
Applicant: General Electric Company
Inventor： Tobias Schuetz , Robert Roesner
CPC classification number: A61N1/3754 , H01B7/08 , H01B17/28 , H01B17/38 , H01B17/50 , H01G4/35 , H02G3/22 , H05K1/0231 , H05K2201/0311 , H05K2201/058 , H05K2201/10272
Abstract: A feedthrough includes a first printed circuit board, a first flexible conductive element coupled to and extending from an edge of the first printed circuit board, a second printed circuit board, and a second flexible conductive element coupled to and extending from an edge of the second printed circuit board.
-
公开(公告)号：US10349549B2
公开(公告)日：2019-07-09
申请号：US15662741
申请日：2017-07-28
Applicant: General Electric Company
Inventor： Tobias Schuetz , Xiaoting Dong , Philipp Leuner
Abstract: A shielded direct current link (“DC link”) busbar includes a central planar element that includes a first surface and a second surface axially opposed to the first surface. The shielded DC link busbar further includes a first conductive lamina disposed over the first surface and a second conductive lamina disposed over the second surface. Further, the first conductive lamina and the second conductive lamina are electrically coupled.
-
公开(公告)号：US10021802B2
公开(公告)日：2018-07-10
申请号：US15268653
申请日：2016-09-19
Applicant: General Electric Company
Inventor： Tobias Schuetz , Philip Michael Cioffi
CPC classification number: H05K7/026 , H01L23/485 , H01L24/49 , H01L25/071 , H02B1/205 , H02M7/003 , H05K7/1432
Abstract: An electronic module is presented. The electronic module includes one or more electronic devices and a first bus electrically coupled to at least one of the one or more electronic devices. The first bus includes a first electrically conductive plate, a second electrically conductive plate, and a first electrically insulating plate disposed between the first electrically conductive plate and the second electrically conductive plate, where in a first portion of the first bus, the first electrically insulating plate is disposed such that the first electrically insulating plate is not in direct physical contact with at least one of the first electrically conductive plate and the second electrically conductive plate to form at least one cavity between the first electrically insulating plate and at least one of the first electrically conductive plate and the second electrically conductive plate. An electronic module assembly having low loop inductance is also presented.
-
-
-
-
-
Search Results
6
records
(took 0.011 seconds)
