公开(公告)号：US09841134B2

公开(公告)日：2017-12-12

申请号：US15011893

申请日：2016-02-01

Applicant: GLOBALFOUNDRIES INC.

Inventor： Tamilmani Ethirajan ,  Ninad D. Sathaye ,  Ashwin Srinivas

IPC: F16L55/26 ,  H04B1/3827 ,  H04L29/08 ,  H04W4/00 ,  F16L101/30

CPC classification number: F16L55/26 ,  F16L2101/30 ,  H04B1/3827 ,  H04L67/12 ,  H04W4/70

Abstract: Systems include, among other components, fixed and mobile sensors positioned within a pipe network containing a substance (such as a liquid, gas, or low-viscosity solid). In addition, systems include a mobile transceiver device positioned within the pipe network. The mobile transceiver device moves through the substance and the pipe network, and the mobile transceiver device is in wireless communication with the sensors. Systems also include a receiver that is external to the pipe network, and the receiver is in communication with the mobile transceiver device. In operation, the mobile transceiver device wirelessly receives sensor data from the sensors, the mobile transceiver device can aggregate the sensor data from multiple sensors, and the mobile transceiver device transmits the aggregated sensor data wirelessly to the receiver.

公开(公告)号：US20170219157A1

公开(公告)日：2017-08-03

申请号：US15011893

申请日：2016-02-01

Applicant: GLOBALFOUNDRIES INC.

Inventor： Tamilmani Ethirajan ,  Ninad D. Sathaye ,  Ashwin Srinivas

IPC: F16L55/26 ,  H04L29/08 ,  H04W4/00 ,  H04B1/3827

CPC classification number: F16L55/26 ,  F16L2101/30 ,  H04B1/3827 ,  H04L67/12 ,  H04W4/70

Abstract: Systems include, among other components, fixed and mobile sensors positioned within a pipe network containing a substance (such as a liquid, gas, or low-viscosity solid). In addition, systems include a mobile transceiver device positioned within the pipe network. The mobile transceiver device moves through the substance and the pipe network, and the mobile transceiver device is in wireless communication with the sensors. Systems also include a receiver that is external to the pipe network, and the receiver is in communication with the mobile transceiver device. In operation, the mobile transceiver device wirelessly receives sensor data from the sensors, the mobile transceiver device can aggregate the sensor data from multiple sensors, and the mobile transceiver device transmits the aggregated sensor data wirelessly to the receiver.

公开(公告)号：US09721059B1

公开(公告)日：2017-08-01

申请号：US15002808

申请日：2016-01-21

Applicant: GLOBALFOUNDRIES INC.

Inventor： Tamilmani Ethirajan ,  Ashwin Srinivas ,  Ananth Sundaram ,  Janakiraman Viraraghavan

IPC: G06F9/455 ,  G06F17/50

CPC classification number: G06F17/5081 ,  G06F17/5022 ,  G06F17/5036 ,  G06F2217/80

Abstract: Disclosed are integrated circuit (IC) design methods, systems and computer program products. During IC design, an electrical netlist with built-in electrical resistance elements (i.e., electrical resistors) is extracted based on an IC design layout. A thermal netlist with built-in thermal resistance elements (i.e., thermal resistors) is automatically extracted based on the electrical netlist. This thermal netlist identifies thermal resistors, external thermal nodes and internal thermal node(s) and does so such that there is one-to-one mapping of the thermal resistors to electrical resistors in the electrical netlist, one-to-one mapping of the external thermal nodes to input, output and power supply nodes in the electrical netlist and one-to-one mapping of the internal thermal node(s) to element(s) (e.g., library and/or customized elements) in the electrical netlist. The electrical and thermal netlists are combined and simulations are performed on the combined electrical-thermal netlist in order to generate a thermal-aware performance model of the IC.

公开(公告)号：US20170212978A1

公开(公告)日：2017-07-27

申请号：US15002808

申请日：2016-01-21

Applicant: GLOBALFOUNDRIES INC.

Inventor： Tamilmani Ethirajan ,  Ashwin Srinivas ,  Ananth Sundaram ,  Janakiraman Viraraghavan

IPC: G06F17/50

CPC classification number: G06F17/5081 ,  G06F17/5022 ,  G06F17/5036 ,  G06F2217/80

Abstract: Disclosed are integrated circuit (IC) design methods, systems and computer program products. During IC design, an electrical netlist with built-in electrical resistance elements (i.e., electrical resistors) is extracted based on an IC design layout. A thermal netlist with built-in thermal resistance elements (i.e., thermal resistors) is automatically extracted based on the electrical netlist. This thermal netlist identifies thermal resistors, external thermal nodes and internal thermal node(s) and does so such that there is one-to-one mapping of the thermal resistors to electrical resistors in the electrical netlist, one-to-one mapping of the external thermal nodes to input, output and power supply nodes in the electrical netlist and one-to-one mapping of the internal thermal node(s) to element(s) (e.g., library and/or customized elements) in the electrical netlist. The electrical and thermal netlists are combined and simulations are performed on the combined electrical-thermal netlist in order to generate a thermal-aware performance model of the IC.