公开(公告)号：US10096557B2

公开(公告)日：2018-10-09

申请号：US15791568

申请日：2017-10-24

Applicant: GLOBALFOUNDRIES INC.

Inventor： Ekta Misra ,  Mukta G. Farooq ,  Krishna Tunga

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/528 ,  H01L21/3205

Abstract: Structure and method for reducing thermal-mechanical stresses generated for a semiconductor device are provided, which includes a tiled-stress-alleviating pad structure.

公开(公告)号：US09842810B1

公开(公告)日：2017-12-12

申请号：US15176595

申请日：2016-06-08

Applicant: GLOBALFOUNDRIES INC.

Inventor： Ekta Misra ,  Mukta G. Farooq ,  Krishna Tunga

IPC: H01L23/00 ,  H01L21/3205 ,  H01L23/528 ,  H01L23/31

CPC classification number: H01L23/562 ,  H01L21/32051 ,  H01L23/3171 ,  H01L23/5283

Abstract: Structure and method for reducing thermal-mechanical stresses generated for a semiconductor device are provided, which includes a tiled-stress-alleviating pad structure.