Abstract:
The present disclosure generally relates to semiconductor structures and, more particularly, to self-aligned back-plane and well contacts for a fully depleted silicon on insulator device and methods of manufacture. The structure includes a back-plane, a p-well and an n-well formed within a bulk substrate; a contact extending from each of the back-plane, the p-well and the n-well; a gate structure formed above the back-plane, the p-well and the n-well; and an insulating spacer isolating the contact of the back-plane from the gate structure.
Abstract:
A semiconductor structure in fabrication includes a n-FinFET and p-FinFET. Stress inducing materials such as silicon and silicon germanium are epitaxially grown into naturally diamond-shaped structures atop the silicon fins of the n-FinFET and p-FinFET areas. The diamond structures act as the source, drain and channel between the source and drain. The diamond structures of the channel are selectively separated from the fin while retaining the fin connections of the diamond-shaped growth of the source and the drain. Further fabrication to complete the structure may then proceed.