公开(公告)号：US20190229079A1

公开(公告)日：2019-07-25

申请号：US15876734

申请日：2018-01-22

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Scott Pozder ,  Thiagarajan Raman ,  Kristina Young-Fisher ,  David Stone

IPC: H01L23/00

Abstract: Bond pad structures and methods for fabricating bond pad structures. A bond pad and a plurality of fill lines are formed on the top surface of a dielectric layer. The fill lines are arranged on the top surface of the dielectric layer adjacent to the bond pad, and may be separated from the bond pad by a fill keep-out zone. One or more Under Bump Metallurgy (UBM) layers may be arranged on the bond pad and may extend outwardly to overlap with the fill lines.

公开(公告)号：US10566300B2

公开(公告)日：2020-02-18

申请号：US15876734

申请日：2018-01-22

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Scott Pozder ,  Thiagarajan Raman ,  Kristina Young-Fisher ,  David Stone

IPC: H01L29/00 ,  H01L23/00

Abstract: Bond pad structures and methods for fabricating bond pad structures. A bond pad and a plurality of fill lines are formed on the top surface of a dielectric layer. The fill lines are arranged on the top surface of the dielectric layer adjacent to the bond pad, and may be separated from the bond pad by a fill keep-out zone. One or more Under Bump Metallurgy (UBM) layers may be arranged on the bond pad and may extend outwardly to overlap with the fill lines.

公开(公告)号：US10224262B2

公开(公告)日：2019-03-05

申请号：US15593969

申请日：2017-05-12

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Kathryn C. Rivera ,  Janak G. Patel ,  David Stone ,  Samantha Donovan

IPC: H01L23/36 ,  H01L23/367 ,  H01L23/552 ,  H01L23/00

Abstract: Heat spreader lids and package assemblies including a heat spreader lid. The heat spreader lid has a central region configured to be coupled with an electronic component, a peripheral region configured to be coupled with a substrate, and a connecting region arranged between the central region and the peripheral region. The connecting region is configured to impart stress relief to the central region.

公开(公告)号：US20180331011A1

公开(公告)日：2018-11-15

申请号：US15593969

申请日：2017-05-12

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Kathryn C. Rivera ,  Janak G. Patel ,  David Stone ,  Samantha Donovan

IPC: H01L23/367 ,  H01L23/552 ,  H01L23/00

CPC classification number: H01L23/3675 ,  H01L23/36 ,  H01L23/552 ,  H01L23/562

Abstract: Heat spreader lids and package assemblies including a heat spreader lid. The heat spreader lid has a central region configured to be coupled with an electronic component, a peripheral region configured to be coupled with a substrate, and a connecting region arranged between the central region and the peripheral region. The connecting region is configured to impart stress relief to the central region.