公开(公告)号：US09293439B2

公开(公告)日：2016-03-22

申请号：US14567052

申请日：2014-12-11

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Edmund Blackshear ,  Elaine Cyr ,  Benjamin Vito Fasano ,  Paul Francis Fortier ,  Marcus E. Interrante ,  Roger Lam ,  Shidong Li ,  Thomas Edward Lombardi ,  Hilton T. Toy ,  Thomas Weiss

IPC: H01L23/00 ,  H01L21/50 ,  H01L23/10 ,  H01L23/367 ,  H01L23/373 ,  H01L23/055 ,  H01L23/42 ,  H01L23/498

CPC classification number: H01L24/83 ,  H01L21/50 ,  H01L23/055 ,  H01L23/10 ,  H01L23/3675 ,  H01L23/3736 ,  H01L23/42 ,  H01L23/49811 ,  H01L23/49822 ,  H01L2224/16225 ,  H01L2224/29036 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/83862 ,  H01L2924/15311

Abstract: An improved electronic module assembly and method of fabrication is disclosed. A patterned array of adhesive is deposited on a laminate, to which a chip is attached. Each region of adhesive is referred to as a lid tie. A lid is placed on the laminate, and is in contact with the lid ties. The lid ties serve to add stability to the laminate and reduce flexing during thermal processing and mechanical stress.