公开(公告)号：US08839168B2

公开(公告)日：2014-09-16

申请号：US13746508

申请日：2013-01-22

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Jongwook Kye ,  Harry J Levinson ,  Jason E Stephens ,  Lei Yuan

IPC: G06F17/50

CPC classification number: G06F17/5081 ,  G03F1/70 ,  G06F17/5068

Abstract: A design methodology for determining a via enclosure rule for use with a self-aligned double pattern (SADP) technique is disclosed. The shape of the block mask serves as a criterion for choosing a via enclosure rule. Different block mask shapes within an integrated circuit design may utilize different rules and provide different margins for via enclosure. A tight via enclosure design rule reduces the margin of a line beyond the via where possible, while a loose via enclosure design rule increases the margin of a line beyond the via where it is beneficial to do so.

Abstract translation: 公开了一种用于确定与自对准双重图案（SADP）技术一起使用的通孔外壳规则的设计方法。 块掩模的形状作为选择通孔封套规则的标准。 集成电路设计中不同的块掩模形状可以利用不同的规则，并为通孔外壳提供不同的边缘。 紧密的通孔外壳设计规则可能会减少超出通孔的线的余量，而松动的通孔外壳设计规则可增加超出通孔的线的裕度，从而有利于此。