Self-aligned process to fabricate a memory cell array with a surrounding-gate access transistor
    1.
    发明授权
    Self-aligned process to fabricate a memory cell array with a surrounding-gate access transistor 有权
    自对准工艺制造具有周围栅极存取晶体管的存储单元阵列

    公开(公告)号:US09240324B2

    公开(公告)日:2016-01-19

    申请号:US14328921

    申请日:2014-07-11

    Abstract: A method to prevent a gate contact from electrically connecting to a source contact for a plurality of memory cells on a substrate. The method includes depositing and etching gate material to partially fill a space between the pillars and to form a word line for the memory cells, etching a gate contact region for the word line between the pair of pillars, forming a spacer of electrically insulating material in the gate contact region, and depositing a gate contact between the pair of pillars to be in electrical contact with the gate material such that the spacer surrounds the gate contact.

    Abstract translation: 一种防止栅极接触与衬底上的多个存储器单元的源极接触电连接的方法。 该方法包括沉积和蚀刻栅极材料以部分地填充柱之间的空间并形成用于存储单元的字线,蚀刻一对柱之间的字线的栅极接触区域,形成电绝缘材料的间隔物 所述栅极接触区域以及在所述一对柱之间沉积栅极接触以与所述栅极材料电接触,使得所述间隔物围绕所述栅极接触。

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