Method, Apparatus and System for Using Free-Electron Laser Compatible EUV Beam for Semiconductor Wafer Metrology
    1.
    发明申请
    Method, Apparatus and System for Using Free-Electron Laser Compatible EUV Beam for Semiconductor Wafer Metrology 有权
    使用自由电子激光兼容的EUV光束用于半导体晶片计量的方法,装置和系统

    公开(公告)号:US20160270200A1

    公开(公告)日:2016-09-15

    申请号:US14645871

    申请日:2015-03-12

    CPC classification number: H05G2/00 H01S3/0903

    Abstract: At least one method, apparatus and system for providing capturing synchrotron radiation for a metrology tool, are disclosed. A beam using a first light emitting device is provided. The first light emitting device comprises a first electron path bend. A first synchrotron radiation is provided from the first electron path bend to a first metrology tool configured to perform a metrology inspection using the first synchrotron radiation.

    Abstract translation: 公开了至少一种用于为计量工具提供捕获同步加速器辐射的方法,装置和系统。 提供了使用第一发光装置的光束。 第一发光器件包括第一电子路径弯曲部。 第一同步加速器辐射从第一电子路径弯曲部提供到被配置为使用第一同步加速器辐射进行计量检查的第一测量工具。

    MASK STRUCTURES AND METHODS OF MANUFACTURING
    2.
    发明申请
    MASK STRUCTURES AND METHODS OF MANUFACTURING 有权
    掩模结构和制造方法

    公开(公告)号:US20150212402A1

    公开(公告)日:2015-07-30

    申请号:US14168396

    申请日:2014-01-30

    CPC classification number: G03F1/24

    Abstract: A lithography mask structure is provided, including: a substrate; at least one reflective layer over the substrate; and an absorber film stack over the at least one reflective layer, the absorber film stack including a plurality of first film layers of a first material and at least one second film layer of a second material. The second material is different from the first material, and the second film layer(s) is interleaved with the plurality of first film layers. In one embodiment, the total thickness of the absorber film stack is less than 50 nm. In another embodiment, the reflectivity of the absorber film stack is less than 2% for a pre-defined wavelength of EUV light. In a further embodiment, the second film layer(s) prevents the average crystallite size of the first film layers from exceeding the thickness of the first film layers.

    Abstract translation: 提供光刻掩模结构,包括:基板; 衬底上的至少一个反射层; 以及在所述至少一个反射层上的吸收膜叠层,所述吸收膜层包括多个第一材料的第一膜层和至少一个第二材料的第二膜层。 第二材料与第一材料不同,并且第二膜层与多个第一膜层交错。 在一个实施例中,吸收膜叠层的总厚度小于50nm。 在另一个实施例中,对于预定波长的EUV光,吸收膜叠层的反射率小于2%。 在另一实施例中,第二膜层防止第一膜层的平均微晶尺寸超过第一膜层的厚度。

Patent Agency Ranking