公开(公告)号：US20150115453A1

公开(公告)日：2015-04-30

申请号：US14591896

申请日：2015-01-07

Applicant: GLOBALFOUNDRIES Singapore Pte.Ltd.

Inventor： Rama Krishna KOTLANKA ,  Rakesh KUMAR ,  Premachandran CHIRAYARIKATHUVEEDU SANKARAPILLAI ,  Huamao LIN ,  Pradeep YELEHANKA

IPC: B81B7/00 ,  H01L23/522 ,  H01L23/48

CPC classification number: B81B7/0006 ,  B81C1/00269 ,  B81C3/001 ,  B81C2201/0115 ,  H01L21/50 ,  H01L23/481 ,  H01L23/5226 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A bonded device having at least one porosified surface is disclosed. The porosification process introduces nanoporous holes into the microstructure of the bonding surfaces of the devices. The material property of a porosified material is softer as compared to a non-porosified material. For the same bonding conditions, the use of the porosified bonding surfaces enhances the bond strength of the bonded interface as compared to the non-porosified material.

Abstract translation: 公开了具有至少一个孔隙化表面的粘合装置。 孔化过程将纳米多孔孔引入装置的结合表面的微结构中。 与非孔隙化材料相比，孔化材料的材料性质更软。 对于相同的接合条件，与非孔隙化材料相比，使用孔隙化粘合表面增强了粘结界面的粘合强度。