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公开(公告)号:US20220059523A1
公开(公告)日:2022-02-24
申请号:US17001009
申请日:2020-08-24
Applicant: GLOBALFOUNDRIES U.S. INC.
Inventor: You LI , Alain F. LOISEAU , Souvick MITRA , Tsung-Che TSAI , Robert J. GAUTHIER, JR. , Meng MIAO
Abstract: The present disclosure relates to semiconductor structures and, more particularly, to an electrostatic discharge (ESD) device and methods of manufacture. The structure (ESD device) includes: a trigger collector region having fin structures of a first dopant type, a collector region having fin structures in a well of a second dopant type and further including a lateral ballasting resistance; an emitter region having a well of the second dopant type and fin structures of the first dopant type; and a base region having a well and fin structures of the second dopant type.
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公开(公告)号:US20230420447A1
公开(公告)日:2023-12-28
申请号:US18462779
申请日:2023-09-07
Applicant: GLOBALFOUNDRIES U.S. Inc.
Inventor: Robert J. GAUTHIER, JR. , Meng MIAO , Alain F. LOISEAU , Souvick MITRA , You LI , Wei LIANG
IPC: H01L27/02 , H01L21/84 , H01L21/8222 , H01L27/12
CPC classification number: H01L27/0259 , H01L27/0288 , H01L27/1207 , H01L21/8222 , H01L21/84
Abstract: The present disclosure relates to semiconductor structures and, more particularly, to electrostatic discharge (ESD) devices and methods of manufacture. The structure (ESD device) includes: a bipolar transistor comprising a collector region, an emitter region and a base region; and a lateral ballasting resistance comprising semiconductor material adjacent to the collector region.
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公开(公告)号:US20220271028A1
公开(公告)日:2022-08-25
申请号:US17185243
申请日:2021-02-25
Applicant: GLOBALFOUNDRIES U.S. Inc.
Inventor: Robert J. GAUTHIER, JR. , Meng MIAO , Alain F. LOISEAU , Souvick MITRA , You LI , Wei LIANG
IPC: H01L27/02 , H01L27/12 , H01L21/8222 , H01L21/84
Abstract: The present disclosure relates to semiconductor structures and, more particularly, to electrostatic discharge (ESD) devices and methods of manufacture. The structure (ESD device) includes: a bipolar transistor comprising a collector region, an emitter region and a base region; and a lateral ballasting resistance comprising semiconductor material adjacent to the collector region.
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公开(公告)号:US20220246749A1
公开(公告)日:2022-08-04
申请号:US17164855
申请日:2021-02-02
Applicant: GLOBALFOUNDRIES U.S. Inc.
Inventor: Meng MIAO , Alain François LOISEAU , Souvick MITRA , Robert John GAUTHIER JR. , You LI , Wei LIANG
Abstract: An ESD protection device may be provided, including: a substrate including a first conductivity region and a second conductivity region arranged therein. The first conductivity region may include a first terminal region and a second terminal region electrically coupled with each other. The second conductivity region may include a third terminal region and a fourth terminal region electrically coupled with each other. The second conductivity region may further include a fifth terminal region electrically coupled with the first and second terminal regions. The fifth terminal region may be arranged laterally between the third terminal region and the fourth terminal region. The first conductivity region, the first terminal region, the third terminal region, and the fifth terminal region may have a first conductivity type. The second conductivity region, the second terminal region, and the fourth terminal region may have a second conductivity type different from the first conductivity type.
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