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公开(公告)号:US20170164522A1
公开(公告)日:2017-06-08
申请号:US14956595
申请日:2015-12-02
Applicant: Google Inc.
Inventor: Eehern J. Wong , Pascal Kam , Thomas R. Kowalski , Ron Drew
CPC classification number: H05K7/20745 , H05K7/1492 , H05K7/2079 , H05K7/20836
Abstract: A data center cooling system includes a plurality of server racks aligned within a row in a human-occupiable workspace of a data center, the server racks supporting a plurality of heat-generating computing devices; a warm air aisle positioned adjacent the server racks opposite the human-occupiable workspace and including a warm air inlet adjacent to a back side of the row of server racks and a warm air outlet in fluid communication with a warm air plenum; a plurality of cooling modules each including at least one fan and a cooling coil; and a controller to perform operations including controlling the plurality of fans in the plurality of cooling modules to operate at a specified fan speed, and controlling a plurality of valves fluidly coupled to the plurality of cooling coils in the plurality of cooling modules to modulate to a specified valve position.
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公开(公告)号:US09091496B2
公开(公告)日:2015-07-28
申请号:US13779159
申请日:2013-02-27
Applicant: Google Inc.
Inventor: Gregory P. Imwalle , Thomas R. Kowalski , Andrew B. Carlson
CPC classification number: F28F27/02 , H05K7/20745 , H05K7/20836
Abstract: A data center cooling system includes a data center having electronic equipment that is supported in multiple racks; a cooling fluid source; multiple cooling units in the data center, where each cooling unit is configured to cool air warmed by a sub-set of the electronic equipment in the data center; multiple control valves, including a control valve associated with a particular cooling unit of the cooling units; and a controller arranged to modulate the control valve associated with a particular cooling unit, to open or close the control valve to substantially maintain an approach temperature set point of the particular cooling unit.
Abstract translation: 数据中心冷却系统包括具有被支撑在多个机架中的电子设备的数据中心; 冷却液源; 数据中心中的多个冷却单元,其中每个冷却单元被配置为冷却由数据中心中的电子设备的子集加热的空气; 多个控制阀,包括与冷却单元的特定冷却单元相关联的控制阀; 以及控制器,其布置成调制与特定冷却单元相关联的控制阀,以打开或关闭控制阀,以基本上保持特定冷却单元的接近温度设定点。
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公开(公告)号:US09949410B1
公开(公告)日:2018-04-17
申请号:US14222097
申请日:2014-03-21
Applicant: Google Inc.
Inventor: Thomas R. Kowalski , Christopher G. Malone , Ankit Somani
IPC: H05K7/20
CPC classification number: H05K7/20745
Abstract: Techniques for operating a data center include providing at least one fan coil unit operable to circulate a cooling airflow to a human-occupiable workspace of the data center; providing a plurality of computer racks arranged in one or more rows in the human-occupiable workspace; forming one or more warm air aisles between the one or more rows of the plurality of computer racks that are in fluid communication with an inlet of the fan coil unit through a warm air plenum, and also with an outlet of the fan coil unit through the human-occupiable workspace and the plurality of computer racks arranged in one or more rows; adjusting the associated electrical power density of one or more of the plurality of computer racks; and based on the adjustment, adjusting a characteristic of the data center.
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公开(公告)号:US09769953B2
公开(公告)日:2017-09-19
申请号:US15016018
申请日:2016-02-04
Applicant: Google Inc.
Inventor: Christopher G. Malone , Thomas R. Kowalski
IPC: H05K7/20 , H01L23/473
CPC classification number: H05K7/20145 , H05K7/20736 , H05K7/20745
Abstract: Techniques for cooling a data center include circulating an airflow, to a warm air plenum of a first module, from rows of racks that support a heat-generating electronic devices; warming the airflow circulated through the racks; circulating the warmed airflow through a warm air inlet of the warm air plenum that is adjacent an open side of the racks and to a warmed air outlet adjacent a data center volume above the racks; circulating the airflow, with a fan positioned in a second module positioned in the data center volume above the racks, through at least one cooling module to cool the warmed airflow, and into a human-occupiable workspace of the data center adjacent the racks; and diverting the warmed airflow with an airflow partition mounted in the data center volume above the racks and adjusted to interrupt the warmed airflow between the warmed air plenum and the human-occupiable workspace.
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公开(公告)号:US20170231111A1
公开(公告)日:2017-08-10
申请号:US15016018
申请日:2016-02-04
Applicant: Google Inc.
Inventor: Christopher G. Malone , Thomas R. Kowalski
IPC: H05K7/20
CPC classification number: H05K7/20145 , H05K7/20736 , H05K7/20745
Abstract: Techniques for cooling a data center include circulating an airflow, to a warm air plenum of a first module, from rows of racks that support a heat-generating electronic devices; warming the airflow circulated through the racks; circulating the warmed airflow through a warm air inlet of the warm air plenum that is adjacent an open side of the racks and to a warmed air outlet adjacent a data center volume above the racks; circulating the airflow, with a fan positioned in a second module positioned in the data center volume above the racks, through at least one cooling module to cool the warmed airflow, and into a human-occupiable workspace of the data center adjacent the racks; and diverting the warmed airflow with an airflow partition mounted in the data center volume above the racks and adjusted to interrupt the warmed airflow between the warmed air plenum and the human-occupiable workspace.
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公开(公告)号:US20130233532A1
公开(公告)日:2013-09-12
申请号:US13779159
申请日:2013-02-27
Applicant: GOOGLE INC.
Inventor: Gregory P. Imwalle , Thomas R. Kowalski , Andrew B. Carlson
IPC: F28F27/02
CPC classification number: F28F27/02 , H05K7/20745 , H05K7/20836
Abstract: A data center cooling system includes a data center having electronic equipment that is supported in multiple racks; a cooling fluid source; multiple cooling units in the data center, where each cooling unit is configured to cool air warmed by a sub-set of the electronic equipment in the data center; multiple control valves, including a control valve associated with a particular cooling unit of the cooling units; and a controller arranged to modulate the control valve associated with a particular cooling unit, to open or close the control valve to substantially maintain an approach temperature set point of the particular cooling unit.
Abstract translation: 数据中心冷却系统包括具有被支撑在多个机架中的电子设备的数据中心; 冷却液源; 数据中心中的多个冷却单元,其中每个冷却单元被配置为冷却由数据中心中的电子设备的子集加热的空气; 多个控制阀,包括与冷却单元的特定冷却单元相关联的控制阀; 以及控制器,其布置成调制与特定冷却单元相关联的控制阀,以打开或关闭控制阀,以基本上保持特定冷却单元的接近温度设定点。
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公开(公告)号:US20180063990A1
公开(公告)日:2018-03-01
申请号:US15707100
申请日:2017-09-18
Applicant: Google Inc.
Inventor: Christopher G. Malone , Thomas R. Kowalski
IPC: H05K7/20
Abstract: Techniques for cooling a data center include circulating an airflow, to a warm air plenum of a first module, from rows of racks that support a heat-generating electronic devices; warming the airflow circulated through the racks; circulating the warmed airflow through a warm air inlet of the warm air plenum that is adjacent an open side of the racks and to a warmed air outlet adjacent a data center volume above the racks; circulating the airflow, with a fan positioned in a second module positioned in the data center volume above the racks, through at least one cooling module to cool the warmed airflow, and into a human-occupiable workspace of the data center adjacent the racks; and diverting the warmed airflow with an airflow partition mounted in the data center volume above the racks and adjusted to interrupt the warmed airflow between the warmed air plenum and the human-occupiable workspace.
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公开(公告)号:US20180027701A1
公开(公告)日:2018-01-25
申请号:US15653973
申请日:2017-07-19
Applicant: Google Inc.
Inventor: Pascal Kam , Grace Wu , Saurin Purohit , Kenneth Dale Shaul , Siddharth Sheli , Thomas R. Kowalski , Bruce Baxter , Jim O'Connor , Brandon Gries , Gerard V. Gioia , Steven K. Bowman
Abstract: A modular data center system includes an upper module including a roller assembly attached to a frame of the upper module, the roller assembly configured to engage at least a portion of a rail assembly attached to a structure of a data center building; and a lower module attachable to the upper module and configured to suspend above a floor of a human-occupiable workspace of the data center that supports a plurality of racks including a plurality of heat-generating electronic devices, the lower module including a power support assembly configured to provide electrical power to the plurality of heat-generating electronic devices.
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