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    Cooling electronic devices in a data center
    1.
    发明授权
    Cooling electronic devices in a data center 有权

    公开(公告)号：US10130013B1

    公开(公告)日：2018-11-13

    申请号：US15360463

    申请日：2016-11-23

    Applicant: Google Inc.

    Inventor： Madhu Krishnan Iyengar ,  Christopher G. Malone ,  Gregory P. Imwalle

    IPC: H05K7/20

    Abstract: A data center cooling system includes an outer container that defines a first volume; an inner container that defines a second volume and is positioned within the first volume, the inner container including an air outlet that includes an airflow path between the first and second volumes; a liquid seal to fluidly isolate a liquid phase of a non-conductive coolant that fills at least a portion of the first and second volumes from an ambient environment; and a plurality of electronic heat-generating devices at least partially immersed in the liquid phase of the non-conductive coolant to transfer a heat load to the non-conductive coolant.

    COOLING A DATA CENTER
    2.
    发明申请
    COOLING A DATA CENTER 审中-公开

    公开(公告)号：US20180063990A1

    公开(公告)日：2018-03-01

    申请号：US15707100

    申请日：2017-09-18

    Applicant: Google Inc.

    Inventor： Christopher G. Malone ,  Thomas R. Kowalski

    IPC: H05K7/20

    Abstract: Techniques for cooling a data center include circulating an airflow, to a warm air plenum of a first module, from rows of racks that support a heat-generating electronic devices; warming the airflow circulated through the racks; circulating the warmed airflow through a warm air inlet of the warm air plenum that is adjacent an open side of the racks and to a warmed air outlet adjacent a data center volume above the racks; circulating the airflow, with a fan positioned in a second module positioned in the data center volume above the racks, through at least one cooling module to cool the warmed airflow, and into a human-occupiable workspace of the data center adjacent the racks; and diverting the warmed airflow with an airflow partition mounted in the data center volume above the racks and adjusted to interrupt the warmed airflow between the warmed air plenum and the human-occupiable workspace.

    Self-contained power and cooling domains
    4.
    发明授权
    Self-contained power and cooling domains 有权
    独立的电源和冷却领域

    公开(公告)号：US09483090B1

    公开(公告)日：2016-11-01

    申请号：US14336691

    申请日：2014-07-21

    Applicant: Google Inc.

    Inventor： Anand Ramesh ,  Jimmy Clidaras ,  Christopher G. Malone

    IPC: G06F1/18 ,  H02K7/18 ,  F01D1/00 ,  H02J1/10 ,  G06F1/20

    CPC classification number: H05K7/20745 ,  F01D15/10 ,  F01K19/10 ,  F05D2220/31 ,  G06F1/189 ,  G06F1/20 ,  G06F2200/201 ,  H02K7/1823 ,  H05K7/1498

    Abstract: A method for providing for conditioning of a computer data center includes supplying a working fluid from a common fluid plane to a plurality of power/cooling units distributed across a data center facility in proximity to electronic equipment that is distributed across the data center facility; converting the working fluid into electric power and cooling capacity at each of the plurality of power/cooling units; and supplying the electric power to a common electric power plane serving a plurality of racks of the electronic equipment in the data center facility and being served by a plurality of the power/cooling units in the data center facility, wherein the common fluid plane serves at least 10 percent of the power/cooling units in the data center facility and the common electric power plane serves at most 5 percent of the electronic equipment in the data center facility.

    Abstract translation: 一种用于提供计算机数据中心的调节的方法包括：将工作流体从公用流体平面供应到分布在数据中心设施附近的数据中心设施附近分布在数据中心设施上的电子设备的多个电力/冷却单元; 将所述工作流体在所述多个动力/制冷单元中的每一个处转换为电力和冷却能力; 并将电力供给到数据中心设备中的服务于电子设备的多个机架的共用电力平面，并且由数据中心设备中的多个电力/冷却单元服务，其中公共流体平面用于 数据中心设施和普通电力平面中的电力/冷却装置的最少10％在数据中心设备中的电子设备的最多5％。

    Managing dependencies between data center computing and infrastructure
    5.
    发明授权
    Managing dependencies between data center computing and infrastructure 有权

    公开(公告)号：US09949410B1

    公开(公告)日：2018-04-17

    申请号：US14222097

    申请日：2014-03-21

    Applicant: Google Inc.

    Inventor： Thomas R. Kowalski ,  Christopher G. Malone ,  Ankit Somani

    IPC: H05K7/20

    CPC classification number: H05K7/20745

    Abstract: Techniques for operating a data center include providing at least one fan coil unit operable to circulate a cooling airflow to a human-occupiable workspace of the data center; providing a plurality of computer racks arranged in one or more rows in the human-occupiable workspace; forming one or more warm air aisles between the one or more rows of the plurality of computer racks that are in fluid communication with an inlet of the fan coil unit through a warm air plenum, and also with an outlet of the fan coil unit through the human-occupiable workspace and the plurality of computer racks arranged in one or more rows; adjusting the associated electrical power density of one or more of the plurality of computer racks; and based on the adjustment, adjusting a characteristic of the data center.

    Cooling a data center
    6.
    发明授权
    Cooling a data center 有权

    公开(公告)号：US09769953B2

    公开(公告)日：2017-09-19

    申请号：US15016018

    申请日：2016-02-04

    Applicant: Google Inc.

    Inventor： Christopher G. Malone ,  Thomas R. Kowalski

    IPC: H05K7/20 ,  H01L23/473

    CPC classification number: H05K7/20145 ,  H05K7/20736 ,  H05K7/20745

    Abstract: Techniques for cooling a data center include circulating an airflow, to a warm air plenum of a first module, from rows of racks that support a heat-generating electronic devices; warming the airflow circulated through the racks; circulating the warmed airflow through a warm air inlet of the warm air plenum that is adjacent an open side of the racks and to a warmed air outlet adjacent a data center volume above the racks; circulating the airflow, with a fan positioned in a second module positioned in the data center volume above the racks, through at least one cooling module to cool the warmed airflow, and into a human-occupiable workspace of the data center adjacent the racks; and diverting the warmed airflow with an airflow partition mounted in the data center volume above the racks and adjusted to interrupt the warmed airflow between the warmed air plenum and the human-occupiable workspace.

    COOLING A DATA CENTER
    7.
    发明申请
    COOLING A DATA CENTER 有权

    公开(公告)号：US20170231111A1

    公开(公告)日：2017-08-10

    申请号：US15016018

    申请日：2016-02-04

    Applicant: Google Inc.

    Inventor： Christopher G. Malone ,  Thomas R. Kowalski

    IPC: H05K7/20

    CPC classification number: H05K7/20145 ,  H05K7/20736 ,  H05K7/20745

    Abstract: Techniques for cooling a data center include circulating an airflow, to a warm air plenum of a first module, from rows of racks that support a heat-generating electronic devices; warming the airflow circulated through the racks; circulating the warmed airflow through a warm air inlet of the warm air plenum that is adjacent an open side of the racks and to a warmed air outlet adjacent a data center volume above the racks; circulating the airflow, with a fan positioned in a second module positioned in the data center volume above the racks, through at least one cooling module to cool the warmed airflow, and into a human-occupiable workspace of the data center adjacent the racks; and diverting the warmed airflow with an airflow partition mounted in the data center volume above the racks and adjusted to interrupt the warmed airflow between the warmed air plenum and the human-occupiable workspace.

    PROVIDING POWER TO A DATA CENTER
    9.
    发明申请
    PROVIDING POWER TO A DATA CENTER 有权
    向数据中心提供电源

    公开(公告)号：US20150337691A1

    公开(公告)日：2015-11-26

    申请号：US14286548

    申请日：2014-05-23

    Applicant: Google Inc.

    Inventor： Ankit Somani ,  Christopher G. Malone

    IPC: F01K15/00

    CPC classification number: F01D15/10 ,  F01K3/08 ,  F01K3/12 ,  F01K3/14 ,  F01K13/02 ,  F01K15/00 ,  F01K25/00 ,  F02C1/04 ,  F28F27/02 ,  H02K7/1823 ,  H05K7/20763 ,  H05K7/2079 ,  H05K7/20827 ,  H05K7/20836

    Abstract: Techniques for providing power to a data center includes transferring heat from a computer data center to warm a fluid stored within an energy regeneration system; circulating the warmed fluid to a flow of compressed gas stored within the energy regeneration system during a discharging process that expands the compressed gas; generating energy with the energy generation system from the discharging process; and providing at least a portion of the generated energy to the computer data center as electrical power.

    Abstract translation: 向数据中心提供电力的技术包括从计算机数据中心传送热量以加热存储在能量再生系统内的流体; 在将膨胀压缩气体的放电过程期间，将加热的流体循环到存储在能量再生系统内的压缩气体流; 从放电过程中用能量发生系统发电; 以及将所产生的能量的至少一部分提供给所述计算机数据中心作为电力。

    Self-contained power and cooling domains
    10.
    发明授权
    Self-contained power and cooling domains 有权

    公开(公告)号：US09854712B1

    公开(公告)日：2017-12-26

    申请号：US15273218

    申请日：2016-09-22

    Applicant: Google Inc.

    Inventor： Anand Ramesh ,  Jimmy Clidaras ,  Christopher G. Malone

    IPC: G06F1/16 ,  H05K5/00 ,  H05K7/00 ,  H05K7/20 ,  F01K19/10 ,  F01D15/10

    CPC classification number: H05K7/20745 ,  F01D15/10 ,  F01K19/10 ,  F05D2220/31 ,  G06F1/189 ,  G06F1/20 ,  G06F2200/201 ,  H02K7/1823 ,  H05K7/1498

    Abstract: A method for providing for conditioning of a computer data center includes supplying a working fluid from a common fluid plane to a plurality of power/cooling units distributed across a data center facility in proximity to electronic equipment that is distributed across the data center facility; converting the working fluid into electric power and cooling capacity at each of the plurality of power/cooling units; and supplying the electric power to a common electric power plane serving a plurality of racks of the electronic equipment in the data center facility and being served by a plurality of the power/cooling units in the data center facility, wherein the common fluid plane serves at least 10 percent of the power/cooling units in the data center facility and the common electric power plane serves at most 5 percent of the electronic equipment in the data center facility.

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