公开(公告)号：US10454349B2

公开(公告)日：2019-10-22

申请号：US14686939

申请日：2015-04-15

Applicant: General Electric Company

Inventor： Sarit Ratadiya ,  Jacob Alan Hubbell ,  Ajith Kuttannair Kumar ,  Mark Murphy ,  Shreenath Shekar Perlaguri

IPC: H02K11/33 ,  H02K3/51 ,  H02M7/00 ,  H02K11/30 ,  H05K7/14

Abstract: An inverter drive assembly includes a first array of inverters, a second array of inverters spaced from the first array of inverters and defining a plenum therebetween, and a crossover bus bar spanning the plenum and electrically connecting the first array of inverters to the second array of inverters. The crossover bus bar includes a first laminated bus section electrically connected to the first array of inverters, a second laminated bus section electrically connected to the second array of inverters, and a solid bus connection interconnecting the first laminated bus section with the second laminated bus section.

公开(公告)号：US10005355B2

公开(公告)日：2018-06-26

申请号：US14604846

申请日：2015-01-26

Applicant: General Electric Company

Inventor： Zachary Brindak ,  Henry Young ,  Theodore Brown ,  Sean Cillessen ,  Mark Murphy

IPC: B60K11/06 ,  H05K7/20 ,  B60K1/00

CPC classification number: B60K11/06 ,  B60K2001/003 ,  H05K7/20918 ,  H05K7/20927

Abstract: An integrated mounting and cooling apparatus includes a housing body having a first mounting surface configured to receive electronic components to be cooled and a heat dissipation channel extending through the housing body under the first mounting surface. An array of cooling fins is disposed in the heat dissipation channel. The apparatus is configured to serve as a mounting surface for the electronic components, as a housing for the electronic components, and a heat-sink to cool the electronic components.

公开(公告)号：US20150210158A1

公开(公告)日：2015-07-30

申请号：US14604846

申请日：2015-01-26

Applicant: General Electric Company

Inventor： Zachary Brindak ,  Henry Young ,  Theodore Brown ,  Sean Cillessen ,  Mark Murphy

IPC: B60K11/06 ,  H05K7/20 ,  H05K5/04

CPC classification number: B60K11/06 ,  B60K2001/003 ,  H05K7/20918 ,  H05K7/20927

Abstract: An integrated mounting and cooling apparatus includes a housing body having a first mounting surface configured to receive electronic components to be cooled and a heat dissipation channel extending through the housing body under the first mounting surface. An array of cooling fins is disposed in the heat dissipation channel. The apparatus is configured to serve as a mounting surface for the electronic components, as a housing for the electronic components, and a heat-sink to cool the electronic components.

Abstract translation: 集成安装和冷却装置包括：壳体，其具有构造成接收待冷却的电子部件的第一安装表面和在第一安装表面下延伸穿过壳体的散热通道。 散热片阵列设置在散热通道中。 该装置构造成用作电子部件的安装表面，用作电子部件的壳体，以及用于冷却电子部件的散热器。