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公开(公告)号：US10533976B2
公开(公告)日：2020-01-14
申请号：US15464946
申请日：2017-03-21
Applicant: General Electric Company
Inventor： Stephan Schmitz , Stephan Falter , Wolfgang Dick , Thomas Weise , Matthias Schwabe
Abstract: An ultrasonic matrix phased array inspection system can include a plurality of curved matrix phased array probes surrounding a test chamber through which a longitudinal test object passes. Fluid injectors can provide a rotating fluid jacket around the longitudinal test object to ultrasonically couple the plurality of curved matrix phased array probes to the longitudinal test object. The plurality of curved matrix phased array probes can remain in a fixed position during inspection and can inspect the longitudinal test object by transmitting ultrasonic sound waves at various angles to identify flaws of any orientation.
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公开(公告)号：US09639056B2
公开(公告)日：2017-05-02
申请号：US14029426
申请日：2013-09-17
Applicant: General Electric Company
Inventor： Stephan Falter , James Norman Barshinger , Dirk Lange , Mark Howard Feydo , Werner Lammerich
CPC classification number: G03H3/00 , G01N29/0663 , G01N29/348 , G01S7/523
Abstract: Systems and methods are disclosed herein in which multi-level square wave excitation signals are used instead of or in addition to fully-analog excitation signals to drive an array of transceiver elements to create a sound field. Use of multi-level square wave excitation signals produces acceptable transceiver output with reduced complexity, cost, and/or power consumption as compared with use of fully-analog excitation signals. In addition, use of such signals facilitates system implementation using application-specific integrated circuits (ASICs) and is not as restricted in voltage level and speed. At the same time, the benefits and applications of fully-analog excitation signals (e.g., acoustic holography, beam superposition, signal-to-noise ratio (SNR) improvements, suppression of parasitic modes, increased material penetration, potential for coded pulsing algorithms and suppression of side lobes in ultrasonic field) can still be achieved with multi-level square wave excitation signals.
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公开(公告)号：US10775743B2
公开(公告)日：2020-09-15
申请号：US16007752
申请日：2018-06-13
Applicant: General Electric Company
Inventor： Stephan Falter , Dieter Lingenberg
Abstract: An ultrasonic holography imaging system and method are provided. The ultrasonic holography imaging system includes an ultrasonic transducer array coupled to an analog processing section. The analog processing section is coupled to a digital processing section. The digital processing section generates digital signals to be converted by the analog processing section into analog signals that are transmitted to individual transceiver elements within the ultrasonic transducer array to cause separate ones of the individual transceiver elements to emit ultrasonic waveforms that are differentiated from each other by one or more parameters, including amplitude, frequency, and phase or modulation thereof.
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公开(公告)号：US20170326592A1
公开(公告)日：2017-11-16
申请号：US15595122
申请日：2017-05-15
Applicant: General Electric Company
Inventor： Alexander Felix Fiseni , Matthew Harvey Krohn , Stephan Falter , Sven Runte
CPC classification number: B06B1/0622 , G01N29/04 , G01N29/262 , G01N29/32 , G01N2291/106 , G10K11/002 , H05K3/32
Abstract: A phased array ultrasonic transducer includes a bonding wire structure, a damping material, a plurality of ultrasonic transducers, and a printed circuit board. The bonding wire structure includes a plurality of bonding wire elements. The damping material surrounds the bonding wire structure and is interposed with the plurality of bonding wire elements. The plurality of ultrasonic transducers is arranged in a matrix beneath a membrane, each of the plurality of ultrasonic transducers being coupled to a corresponding bonding wire element of the plurality of bonding wire elements. The printed circuit board includes a plurality of circuits. Each of the plurality of circuits is coupled to a corresponding bonding wire element of the plurality of bonding wire elements.
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公开(公告)号：US20140305219A1
公开(公告)日：2014-10-16
申请号：US13861173
申请日：2013-04-11
Applicant: GENERAL ELECTRIC COMPANY , V & M DEUTSCHLAND GMBH
Inventor： Stephan Falter , Stefan Georg Nitsche
IPC: G01N29/34
CPC classification number: G01N29/343 , B06B1/0625 , G01N29/221 , G01N2291/0289 , G01N2291/106 , G10K11/32
Abstract: An array of ultrasonic transducers in a conical formation emits pulses of ultrasonic simultaneously so that an anomaly of any orientation in a test object can be detected efficiently.
Abstract translation: 圆锥形结构中的超声波换能器阵列同时发射超声波脉冲，从而可以有效地检测测试对象中任何取向的异常。
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Patent Agency Ranking
公开(公告)号：US10724998B2
公开(公告)日：2020-07-28
申请号：US15873878
申请日：2018-01-17
Applicant: General Electric Company
Inventor： Sebastian Standop , Prashanth Kumar Chinta , Guenter Fuchs , Stephan Falter
Abstract: A method and system for inspecting a rail profile include using ultrasonic phased arrays. Determined anomalies, such as material flaws like volumetric defects and cracks, in a fluid-immersed rail profile are detected by employing one or more phased array probes located proximate the rail profile. Electronic delays and beam steering and focusing can be employed to tailor the inspection to the rail geometry.
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公开(公告)号：US20170276649A1
公开(公告)日：2017-09-28
申请号：US15464946
申请日：2017-03-21
Applicant: General Electric Company
Inventor： Stephan Schmitz , Stephan Falter , Wolfgang Dick , Thomas Weise , Matthias Schwabe
CPC classification number: G01N29/27 , G01N29/043 , G01N29/221 , G01N29/223 , G01N29/26 , G01N29/262 , G01N29/28 , G01N2291/0289 , G01N2291/106 , G01N2291/262 , G01N2291/2626 , G01N2291/2634
Abstract: An ultrasonic matrix phased array inspection system can include a plurality of curved matrix phased array probes surrounding a test chamber through which a longitudinal test object passes. Fluid injectors can provide a rotating fluid jacket around the longitudinal test object to ultrasonically couple the plurality of curved matrix phased array probes to the longitudinal test object. The plurality of curved matrix phased array probes can remain in a fixed position during inspection and can inspect the longitudinal test object by transmitting ultrasonic sound waves at various angles to identify flaws of any orientation.
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公开(公告)号：US20140211588A1
公开(公告)日：2014-07-31
申请号：US13750582
申请日：2013-01-25
Applicant: GENERAL ELECTRIC COMPANY
Inventor： Stephan Falter , Dieter Lingenberg
IPC: G03H3/00
CPC classification number: G03H3/00 , G01N29/0663 , G01N2291/0423 , G01N2291/0427 , G01N2291/106 , G01S15/8925 , G01S15/897 , G01S15/8977 , G01S15/8993 , Y10T29/49005
Abstract: An ultrasonic holography imaging system and method are provided. The ultrasonic holography imaging system includes an ultrasonic transducer array coupled to an analog processing section. The analog processing section is coupled to a digital processing section. The digital processing section generates digital signals to be converted by the analog processing section into analog signals that are transmitted to individual transceiver elements within the ultrasonic transducer array to cause separate ones of the individual transceiver elements to emit ultrasonic waveforms that are differentiated from each other by one or more parameters, including amplitude, frequency, and phase or modulation thereof.
Abstract translation: 提供超声全息成像系统和方法。 超声全息成像系统包括耦合到模拟处理部分的超声波换能器阵列。 模拟处理部分耦合到数字处理部分。 数字处理部分将由模拟处理部分转换成的数字信号转换为发送到超声波换能器阵列内的各个收发器元件的模拟信号，以使各个收发器元件中的单独收发器元件发射彼此不同的超声波形， 一个或多个参数，包括振幅，频率和相位或调制。
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公开(公告)号：US11471911B2
公开(公告)日：2022-10-18
申请号：US15595122
申请日：2017-05-15
Applicant: General Electric Company
Inventor： Alexander Felix Fiseni , Matthew Harvey Krohn , Stephan Falter , Sven Runte
Abstract: A phased array ultrasonic transducer includes a bonding wire structure, a damping material, a plurality of ultrasonic transducers, and a printed circuit board. The bonding wire structure includes a plurality of bonding wire elements. The damping material surrounds the bonding wire structure and is interposed with the plurality of bonding wire elements. The plurality of ultrasonic transducers is arranged in a matrix beneath a membrane, each of the plurality of ultrasonic transducers being coupled to a corresponding bonding wire element of the plurality of bonding wire elements. The printed circuit board includes a plurality of circuits. Each of the plurality of circuits is coupled to a corresponding bonding wire element of the plurality of bonding wire elements.
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公开(公告)号：US10684261B2
公开(公告)日：2020-06-16
申请号：US15468212
申请日：2017-03-24
Applicant: General Electric Company
Inventor： Stephan Falter , Alexander Felix Fiseni , Stephan Schmitz , Daniel Koers , Matthias Erhard Schwabe
Abstract: An inspection system for performing an inspection of an end region of a part is provided. The inspection system includes a robotic assembly positioned along a side of the part. The inspection system includes an ultrasonic probe coupled to the robotic assembly and positioned in proximity to the end region of the part. The ultrasonic probe is moved by the robotic assembly along a path to inspect the end region of the part. During the inspection, the ultrasonic probe transmits a signal towards the end region of the part and receives a reflected signal from the end region of the part. The inspection system provides, as a single system, for inspection of both a body of the part and the end region of the part.
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