Ultrasonic inspection system
    1.
    发明授权

    公开(公告)号:US10533976B2

    公开(公告)日:2020-01-14

    申请号:US15464946

    申请日:2017-03-21

    IPC分类号: G01N29/04 G01N29/28 G01N29/27

    摘要: An ultrasonic matrix phased array inspection system can include a plurality of curved matrix phased array probes surrounding a test chamber through which a longitudinal test object passes. Fluid injectors can provide a rotating fluid jacket around the longitudinal test object to ultrasonically couple the plurality of curved matrix phased array probes to the longitudinal test object. The plurality of curved matrix phased array probes can remain in a fixed position during inspection and can inspect the longitudinal test object by transmitting ultrasonic sound waves at various angles to identify flaws of any orientation.

    Acoustical holography with multi-level square wave excitation signals

    公开(公告)号:US09639056B2

    公开(公告)日:2017-05-02

    申请号:US14029426

    申请日:2013-09-17

    摘要: Systems and methods are disclosed herein in which multi-level square wave excitation signals are used instead of or in addition to fully-analog excitation signals to drive an array of transceiver elements to create a sound field. Use of multi-level square wave excitation signals produces acceptable transceiver output with reduced complexity, cost, and/or power consumption as compared with use of fully-analog excitation signals. In addition, use of such signals facilitates system implementation using application-specific integrated circuits (ASICs) and is not as restricted in voltage level and speed. At the same time, the benefits and applications of fully-analog excitation signals (e.g., acoustic holography, beam superposition, signal-to-noise ratio (SNR) improvements, suppression of parasitic modes, increased material penetration, potential for coded pulsing algorithms and suppression of side lobes in ultrasonic field) can still be achieved with multi-level square wave excitation signals.

    ULTRASONIC HOLOGRAPHY IMAGING SYSTEM AND METHOD
    5.
    发明申请
    ULTRASONIC HOLOGRAPHY IMAGING SYSTEM AND METHOD 有权
    超声全息成像系统及方法

    公开(公告)号:US20140211588A1

    公开(公告)日:2014-07-31

    申请号:US13750582

    申请日:2013-01-25

    IPC分类号: G03H3/00

    摘要: An ultrasonic holography imaging system and method are provided. The ultrasonic holography imaging system includes an ultrasonic transducer array coupled to an analog processing section. The analog processing section is coupled to a digital processing section. The digital processing section generates digital signals to be converted by the analog processing section into analog signals that are transmitted to individual transceiver elements within the ultrasonic transducer array to cause separate ones of the individual transceiver elements to emit ultrasonic waveforms that are differentiated from each other by one or more parameters, including amplitude, frequency, and phase or modulation thereof.

    摘要翻译: 提供超声全息成像系统和方法。 超声全息成像系统包括耦合到模拟处理部分的超声波换能器阵列。 模拟处理部分耦合到数字处理部分。 数字处理部分将由模拟处理部分转换成的数字信号转换为发送到超声波换能器阵列内的各个收发器元件的模拟信号,以使各个收发器元件中的单独收发器元件发射彼此不同的超声波形, 一个或多个参数,包括振幅,频率和相位或调制。

    Ultrasonic holography imaging system and method

    公开(公告)号:US10775743B2

    公开(公告)日:2020-09-15

    申请号:US16007752

    申请日:2018-06-13

    IPC分类号: G03H3/00 G01S15/89 G01N29/06

    摘要: An ultrasonic holography imaging system and method are provided. The ultrasonic holography imaging system includes an ultrasonic transducer array coupled to an analog processing section. The analog processing section is coupled to a digital processing section. The digital processing section generates digital signals to be converted by the analog processing section into analog signals that are transmitted to individual transceiver elements within the ultrasonic transducer array to cause separate ones of the individual transceiver elements to emit ultrasonic waveforms that are differentiated from each other by one or more parameters, including amplitude, frequency, and phase or modulation thereof.

    Phased array ultrasonic transducer and method of manufacture

    公开(公告)号:US11471911B2

    公开(公告)日:2022-10-18

    申请号:US15595122

    申请日:2017-05-15

    摘要: A phased array ultrasonic transducer includes a bonding wire structure, a damping material, a plurality of ultrasonic transducers, and a printed circuit board. The bonding wire structure includes a plurality of bonding wire elements. The damping material surrounds the bonding wire structure and is interposed with the plurality of bonding wire elements. The plurality of ultrasonic transducers is arranged in a matrix beneath a membrane, each of the plurality of ultrasonic transducers being coupled to a corresponding bonding wire element of the plurality of bonding wire elements. The printed circuit board includes a plurality of circuits. Each of the plurality of circuits is coupled to a corresponding bonding wire element of the plurality of bonding wire elements.