Abstract:
Methodologies enabling BEoL VNCAPs in ICs and resulting devices are disclosed. Embodiments include: providing a plurality of mandrel recesses extending horizontally on a substrate, each of the mandrel recesses having an identical width and being separated from another one of the mandrel recesses by an identical distance; providing a plurality of routes, each of the plurality of routes being positioned in a different one of the mandrel recesses; and providing first and second vertical segments on the substrate, the first vertical segment being connected to a set of the plurality of routes and separated from the second vertical segment, and the second vertical segment being separated from the set of routes.