公开(公告)号：US09142513B2

公开(公告)日：2015-09-22

申请号：US14645598

申请日：2015-03-12

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Mahbub Rashed ,  Yuansheng Ma ,  Irene Lin ,  Jason Stephens ,  Yunfei Deng ,  Yuan Lei ,  Jongwook K E ,  Roderick Augur ,  Shibly Ahmed ,  Subramani Kengeri ,  Suresh Venkatesan

IPC: H01L23/538 ,  H01L29/78 ,  H01L27/092 ,  H01L27/02

CPC classification number: H01L23/5386 ,  H01L21/76895 ,  H01L21/823871 ,  H01L23/5384 ,  H01L27/0207 ,  H01L27/0924 ,  H01L29/7851 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An approach for providing MOL constructs using diffusion contact structures is disclosed. Embodiments include: providing a first diffusion region in a substrate; providing, via a first lithography process, a first diffusion contact structure; providing, via a second lithography process, a second diffusion contact structure; and coupling the first diffusion contact structure to the first diffusion region and the second diffusion contact structure. Embodiments include: providing a second diffusion region in the substrate; providing a diffusion gap region between the first and second diffusion regions; providing the diffusion contact structure over the diffusion gap region; and coupling, via the diffusion contact structure, the first and second diffusion regions.

公开(公告)号：US08987816B2

公开(公告)日：2015-03-24

申请号：US14519902

申请日：2014-10-21

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Jason Stephens ,  Marc Tarabbia ,  Nader Hindawy ,  Roderick Augur

IPC: H01L21/768 ,  H01L23/48 ,  H01L27/088 ,  H01L29/49 ,  G06F17/50

CPC classification number: H01L23/481 ,  G06F17/5077 ,  H01L21/76877 ,  H01L23/5286 ,  H01L27/088 ,  H01L29/41725 ,  H01L29/4916 ,  H01L2027/11861 ,  H01L2027/11881 ,  H01L2924/0002 ,  Y02T10/82 ,  H01L2924/00

Abstract: A method for forming CA power rails using a three mask decomposition process and the resulting device are provided. Embodiments include forming a horizontal diffusion CA power rail in an active layer of a semiconductor substrate using a first color mask; forming a plurality of vertical CAs in the active layer using second and third color masks, the vertical CAs connecting the CA power rail to at least one diffusion region on the semiconductor substrate, spaced from the CA power rail, wherein each pair of CAs formed by one of the second and third color masks are separated by at least two pitches.

Abstract translation: 提供了使用三掩模分解处理形成CA电力轨道的方法和所得到的装置。 实施例包括使用第一颜色掩模在半导体衬底的有源层中形成水平扩散CA电力轨道; 使用第二和第三颜色掩模在有源层中形成多个垂直CA，垂直CA将CA电力轨连接到半导体衬底上与CA电力轨道间隔开的至少一个扩散区，其中每对CA由 第二和第三彩色掩模中的一个被至少两个间距分开。

公开(公告)号：US08856715B1

公开(公告)日：2014-10-07

申请号：US13948249

申请日：2013-07-23

Applicant: GlobalFoundries Inc.

Inventor： Jason Stephens ,  Vikrant Chauhan ,  Lawrence Clevenger ,  Ning Lu ,  Albert Chu

IPC: G06F17/50

CPC classification number: G06F17/5077

Abstract: Methodologies enabling BEoL VNCAPs in ICs and resulting devices are disclosed. Embodiments include: providing a plurality of mandrel recesses extending horizontally on a substrate, each of the mandrel recesses having an identical width and being separated from another one of the mandrel recesses by an identical distance; providing a plurality of routes, each of the plurality of routes being positioned in a different one of the mandrel recesses; and providing first and second vertical segments on the substrate, the first vertical segment being connected to a set of the plurality of routes and separated from the second vertical segment, and the second vertical segment being separated from the set of routes.

Abstract translation: 公开了在IC和结果设备中使用BEoL VNCAP的方法。 实施例包括：提供在基板上水平延伸的多个心轴凹槽，每个心轴凹槽具有相同的宽度，并且与另一个心轴凹槽分开相同的距离; 提供多条路线，所述多条路线中的每条路线被定位在不同的心轴凹槽中; 以及在所述基板上提供第一和第二垂直段，所述第一垂直段连接到所述多条路线的一组，并与所述第二垂直段分离，并且所述第二垂直段与所述路线组分离。