公开(公告)号：US20240219636A1

公开(公告)日：2024-07-04

申请号：US18093039

申请日：2023-01-04

Applicant: GlobalFoundries U.S. Inc.

Inventor： Bartlomiej Jan Pawlak ,  Oscar D. Restrepo ,  Koushik Ramachandran ,  Yusheng Bian ,  Eduardo Cruz Silva

IPC: G02B6/122 ,  G02B6/13

CPC classification number: G02B6/1228 ,  G02B6/13 ,  G02B2006/12121

Abstract: Structures including an edge coupler and methods of forming such structures. The structure comprises a dielectric layer on a semiconductor substrate. The dielectric layer includes a cavity and an edge defining a boundary of the cavity. The structure further comprises an edge coupler including a waveguide core. The waveguide core includes a portion that extends past the edge of the dielectric layer and overhangs the cavity. The structure further comprises a heater positioned adjacent to the portion of the waveguide core. The heater is spaced by a gap from the portion of the waveguide core.