公开(公告)号：US20210013368A1

公开(公告)日：2021-01-14

申请号：US16088564

申请日：2017-12-19

Applicant: Goertek Inc.

Inventor： Xiangxu FENG ,  Peixuan CHEN ,  Quanbo ZOU

IPC: H01L33/00 ,  H01L33/62

Abstract: The present disclosure discloses a micro-LED transfer method, a manufacturing method, device and an electronic apparatus. The transfer method comprises: in accordance with a sequence of micro-LEDs of blue, green and red, epitaxially growing micro-LEDs of two or all of the three colors on a single GaAs original substrate; epitaxially growing bumping electrodes corresponding to the micro-LEDs on a receiving substrate; bonding the micro-LEDs of the two or all of the three colors with the bumping electrodes on the receiving substrate; and removing the GaAs original substrate. The method can be used to transfer micro-LEDs of a variety of colors, in order to improve the production efficiency.

公开(公告)号：US20200152693A1

公开(公告)日：2020-05-14

申请号：US16473538

申请日：2017-01-24

Applicant: Goertek Inc.

Inventor： QUANBO ZOU ,  Peixuan CHEN ,  Xiangxu FENG

IPC: H01L27/15 ,  H01L25/18

Abstract: A micro-LED device, a display apparatus and a method for manufacturing a micro-LED device are provided. The micro-LED device comprises: a growth substrate; a plurality of vertical micro-LEDs formed on the growth substrate; a first type electrode formed on top of each of the vertical micro-LEDs; and a second type electrode formed on side surface of each of the vertical micro-LEDs.

公开(公告)号：US20190267426A1

公开(公告)日：2019-08-29

申请号：US16320019

申请日：2016-08-22

Applicant: GOERTEK INC.

Inventor： Quanbo ZOU ,  Peixuan CHEN ,  Xiangxu FENG

IPC: H01L27/15 ,  H01L33/62 ,  H01L33/60 ,  H01L33/00

Abstract: A micro-LED transfer method, manufacturing method and device are provided. The micro-LED transfer method comprises: obtaining a laser-transparent carrier substrate having a first surface and a second surface with micro-LEDs; forming a protection layer on at least one of the first surface and the second surface and a third surface of a receiving substrate, wherein the third surface is to receive the micro-LEDs to be transferred via pads; bringing the micro-LEDs to be transferred into contact with the pads on the third surface; and irradiating the micro-LEDs to be transferred with laser from the first surface to lift-off the micro-LEDs to be transferred from the carrier substrate, wherein the protection layer is configured to protect the third surface from the irradiation of the laser.

公开(公告)号：US20210135044A1

公开(公告)日：2021-05-06

申请号：US16605081

申请日：2017-04-19

Applicant: GOERTEK INC.

Inventor： Quanbo ZOU ,  Xiaoyang ZHANG ,  Peixuan CHEN ,  Xiangxu FENG ,  Tao GAN ,  Zhe WANG

IPC: H01L33/00 ,  H01L25/075

Abstract: It is disclosed a micro-LED transfer method, manufacturing method and display device. The method for transferring a micro-LED array comprises: patterning conductive resist on a receiving substrate to cover electrodes for the micro-LED array to be transferred; bonding the micro-LED array on a first substrate with the receiving substrate through the conductive resist, wherein the first substrate is laser transparent; irradiating laser onto the micro-LED array from a side of the first substrate to lift-off the micro-LED array from the first substrate. According to an embodiment, the performance of a micro-LED device may be improved.

公开(公告)号：US20200075560A1

公开(公告)日：2020-03-05

申请号：US16609269

申请日：2017-06-15

Applicant: GOERTEK INC.

Inventor： Quanbo ZOU ,  Peixuan CHEN

IPC: H01L25/075 ,  H01L33/62 ,  H01L33/00

Abstract: A method for transferring micro-light emitting diodes, a micro-light emitting diode device and an electronic device. The method for transferring micro-light emitting diodes comprises: providing bumps of bonding agent on electrode bonding pads of a receiving substrate and/or on micro-light emitting diodes of an original substrate; aligning and contacting the electrode bonding pads of the receiving substrate and the micro-light emitting diodes of the original substrate, to position the bumps of bonding agent between the micro-light emitting diodes and the electrode bonding pads; irradiating locally by using a first laser from the original substrate side, to melt the bumps of bonding agent to bond the micro-light emitting diodes and the electrode bonding pads; and stripping off the micro-light emitting diodes from the original substrate, to transfer the micro-light emitting diodes to the receiving substrate.

公开(公告)号：US20200219855A1

公开(公告)日：2020-07-09

申请号：US16643307

申请日：2017-07-24

Applicant: GOERTEK INC.

Inventor： Peixuan CHEN ,  Quanbo ZOU ,  Xiangxu FENG ,  Tao GAN ,  Xiaoyang ZHANG

IPC: H01L25/075 ,  H01L21/78 ,  H01L33/48 ,  G09F9/33 ,  H01L33/00 ,  H01L21/683

Abstract: A micro-LED display device and a manufacturing method thereof are disclosed. The method comprises: forming micro-LEDs (202) on a carrier substrate (201), wherein the carrier substrate (201) is transparent for a laser which is used in laser lifting-off; filling trenches between the micro-LEDs (202) on the carrier substrate (201) with a holding material (209); performing a laser lifting-off on selected ones of the micro-LEDs (202) to lift off them from the carrier substrate (201), wherein the selected micro-LEDs (202) are held on the carrier substrate (201) through the holding material (209); bonding the selected micro-LEDs (202) onto a receiving substrate (207) of the micro-LED display device; separating the selected micro-LEDs (202) from the carrier substrate (201) to transfer them to the receiving substrate (207).

公开(公告)号：US20210141298A1

公开(公告)日：2021-05-13

申请号：US16475758

申请日：2017-01-09

Applicant: GOERTEK, INC

Inventor： Peixuan CHEN ,  Quanbo ZOU ,  Xiangxu FENG

IPC: G03B21/20 ,  G03B21/00

Abstract: A projection module and an electronics apparatus are provided. The projection module comprises: a projection chip, having micro semiconductor light emitting devices thereon; and a projection lens unit, wherein the micro semiconductor light emitting devices produce projection light to create a projection image, and the projection lens unit receives the projection image and projects it to a projection surface.