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    MICRO-LED TRANSFER METHOD AND MANUFACTURING METHOD
    3.
    发明申请
    MICRO-LED TRANSFER METHOD AND MANUFACTURING METHOD 审中-公开

    公开(公告)号：US20190319165A1

    公开(公告)日：2019-10-17

    申请号：US16347617

    申请日：2016-11-07

    Applicant: GOERTEK. INC

    Inventor： QUANBO ZOU

    IPC: H01L33/00 ,  H01L33/62 ,  H01L25/075 ,  H01L23/00

    Abstract: A micro-LED transfer method and manufacturing method. The micro-LED (303) transfer method comprises: bringing pickup units (305) of a transfer head in contact with micro-LEDs (303) on a carrier substrate (301), wherein the pickup units (305) are able to apply current to the micro-LEDs (303); applying current to the micro-LEDs (303) via the pickup units (305) to heat up bonding layers (302) between the micro-LEDs (303) and the carrier substrate (301) to be melted; picking up the micro-LEDs (303) from the carrier substrate (301) with the transfer head; bonding the micro-LEDs (303) onto a receiving substrate (307); and removing the transfer head from the micro-LEDs.

    MEMS CAPACITOR MICROPHONE
    4.
    发明申请
    MEMS CAPACITOR MICROPHONE 有权

    公开(公告)号：US20210227335A1

    公开(公告)日：2021-07-22

    申请号：US16760540

    申请日：2018-09-06

    Applicant: Goertek, Inc.

    Inventor： QUANBO ZOU ,  Yongwei Dong

    IPC: H04R19/04 ,  H04R7/06 ,  H04R7/18 ,  H04R1/06 ,  H04R3/00 ,  B81B3/00

    Abstract: An MEMS capacitor microphone is provided, comprising a first substrate and a vibration diaphragm supported above the first substrate by a spacing portion, the first substrate, the spacing portion, and the vibration diaphragm enclosing a vacuum chamber, and a static deflection distance of the vibration diaphragm under an atmospheric pressure being less than a distance between the vibration diaphragm and the first substrate, wherein a lower electrode forming a capacitor structure with the vibration diaphragm is provided on a side of the first substrate that is adjacent to the vacuum chamber, and an electric field between the vibration diaphragm and the lower electrode is 100-300 V/μm.

    A MEMS MICROPHONE, A MANUFACTURING METHOD THEREOF AND AN ELECTRONIC APPARATUS
    5.
    发明申请
    A MEMS MICROPHONE, A MANUFACTURING METHOD THEREOF AND AN ELECTRONIC APPARATUS 有权

    公开(公告)号：US20210078856A1

    公开(公告)日：2021-03-18

    申请号：US16619980

    申请日：2017-06-09

    Applicant: GOERTEK. INC

    Inventor： QUANBO ZOU

    IPC: B81B3/00 ,  H04R19/04 ,  H04R31/00

    Abstract: A MEMS microphone, a manufacturing method thereof and an electronic apparatus are disclosed. The MEMS microphone comprises: a MEMS microphone device including a MEMS microphone chip and a mesh membrane monolithically integrated with the MEMS microphone chip; and a housing including an acoustic port, wherein the MEMS microphone device is mounted in the housing, and the mesh membrane is arranged between the MEMS microphone chip and the acoustic port as a particle filter for the MEMS microphone chip.

    MICRO-LED TRANSFER METHOD AND MANUFACTURING METHOD
    6.
    发明申请
    MICRO-LED TRANSFER METHOD AND MANUFACTURING METHOD 审中-公开

    公开(公告)号：US20190319164A1

    公开(公告)日：2019-10-17

    申请号：US16347614

    申请日：2016-11-07

    Applicant: GOERTEK, INC

    Inventor： QUANBO ZOU

    IPC: H01L33/00 ,  H01L33/62 ,  H01L25/075 ,  H01L23/00

    Abstract: Disclosed a micro-LED transfer method and manufacturing method. The micro-LED transfer method comprises: bringing pickup units (305, 605, 705) of a transfer head in contact with micro-LEDs (303, 603, 703) on a carrier substrate (301, 601, 701), wherein the pickup units (305, 605, 705) are able to apply current to the micro-LEDs (303, 603, 703); applying current to the micro-LEDs (303, 603, 703) via the pickup units (305, 605, 705) to obtain I-V characteristics of the micro-LEDs (303, 603, 703); determining known-good-die micro-LEDs based on the I-V characteristics; and transferring the known-good-die micro-LEDs from the carrier substrate to a receiving substrate (307, 608, 708) by using the transfer head.

    MEMS DEVICE AND ELECTRONICS APPARATUS
    7.
    发明申请
    MEMS DEVICE AND ELECTRONICS APPARATUS 审中-公开

    公开(公告)号：US20200039817A1

    公开(公告)日：2020-02-06

    申请号：US16339460

    申请日：2016-10-08

    Applicant: GOERTEK. INC

    Inventor： QUANBO ZOU ,  ZHE WANG ,  YOU WANG ,  XIANBIN WANG

    IPC: B81B7/00 ,  H04R19/01 ,  H04R19/00 ,  H04R1/04

    Abstract: The present invention discloses a MEMS device and an electronics apparatus. The MEMS device comprises: a substrate; a MEMS element placed on the substrate; a cover encapsulating the MEMS element together with the substrate; and a port for the MEMS element to access outside, wherein the port is provided with a filter which has mesh holes and includes electrets to prevent particles from entering into the MEMS element.

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