公开(公告)号：US20190028814A1

公开(公告)日：2019-01-24

申请号：US15743509

申请日：2017-05-25

申请人： Goertek Inc.

发明人： Junkai ZHAN ,  Mengjin CAI ,  Zonglin ZHOU

IPC分类号： H04R19/04 ,  H04R7/04 ,  H04R7/18

CPC分类号： H04R19/04 ,  B06B1/0292 ,  G10K9/12 ,  H04R1/2823 ,  H04R7/04 ,  H04R7/18 ,  H04R19/005 ,  H04R31/003 ,  H04R2201/003 ,  H04R2207/021

摘要： An MEMS microphone is disclosed, which comprises a substrate and a vibrating diaphragm and a back electrode which are located above the substrate, a plurality of comb tooth parts are formed in edge positions of the vibrating diaphragm, and the plurality of comb tooth parts are distributed in a peripheral direction of the vibrating diaphragm at intervals, wherein a position between every two adjacent comb tooth parts on the vibrating diaphragm is connected to the substrate via an insulating layer; and the comb tooth parts on the vibrating diaphragm are at least partially overlapped with the substrate, and a clearance exists between the comb tooth parts and the substrate and is configured as an airflow circulation channel. The microphone of the present invention has better impact resistance and can avoid intrusion of dust.

公开(公告)号：US20180362331A1

公开(公告)日：2018-12-20

申请号：US15739913

申请日：2017-03-03

申请人： Goertek Inc.

发明人： Junkai ZHAN ,  Zonglin ZHOU ,  Guanxun Qiu ,  Mengjin CAI

IPC分类号： B81B7/00 ,  B81C1/00

CPC分类号： B81B7/0058 ,  B81B2201/02 ,  B81C1/00261 ,  B81C3/001

摘要： A method for forming a filter net on an MEMS sensor and an MEMS sensor are disclosed. The method comprises the following steps: disposing a dissociable adhesive tape on a base material, and forming a filter net on an adhesive surface of the dissociable adhesive tape; transferring the filter net on a film to form a self-adhesive coiled material; and transferring and adhering the filter net on the self-adhesive coiled material to collecting a hole of the MEMS sensor. The filter net formed by the method have fine and uniform meshes, and a yield is high. In addition, the method is suitable for large-scale and industrialized production.

公开(公告)号：US20180359571A1

公开(公告)日：2018-12-13

申请号：US15781364

申请日：2015-12-14

申请人： Goertek Inc.

发明人： Junkai ZHAN ,  Mengjin CAI ,  Guanxun QIU ,  Zonglin ZHOU ,  Qinglin SONG

IPC分类号： H04R19/04 ,  B81C1/00 ,  B81B7/00 ,  H04R31/00

CPC分类号： H04R19/04 ,  B81B7/0029 ,  B81B7/02 ,  B81B2201/0257 ,  B81B2201/0292 ,  B81C1/00158 ,  H04R19/005 ,  H04R31/00 ,  H04R2201/003

摘要： An acoustic sensor integrated MEMS microphone structure and a fabrication method thereof. A diaphragm (3e) and back-pole (7) which forms a condenser structure are formed on a substrate (1) having at least one recessed slot (1a) on the top. A sensitive electrode is formed on the substrate (1), the sensitive electrode comprising a fixed portion (3b) fixed on the substrate (1) via a sacrificial layer (2), and a bending portion (3a) inserted into the recessed slot (1a), wherein the bending portion and the side wall of the recessed slot form the condenser structure. The integrated structure integrates the condenser structure of the microphone and condenser structure of the acoustic sensor on a substrate (1), thereby increasing the integration level thereof and reducing the overall size of the package. Meanwhile, the microphone diaphragm (3e) and the sensitive electrode of the acoustic sensor can be fabricated on a same substrate (1) at the same time, from the same material, and using the same fabricating process to increase production efficiency.