公开(公告)号：US11953392B1

公开(公告)日：2024-04-09

申请号：US18370897

申请日：2023-09-21

申请人： Wuxi Sencoch Semiconductor Co., Ltd.

发明人： Tongqing Liu

IPC分类号： G01L9/06 ,  B81B7/00 ,  B81C1/00 ,  G01L19/04 ,  G01L19/06

CPC分类号： G01L19/0618 ,  B81B7/0032 ,  B81C1/00261 ,  B81C1/0069 ,  G01L19/04

摘要： The present application discloses a packaging structure and method of an MEMS pressure sensor. The packaging structure of the MEMS pressure sensor includes: a film, forming a sealing chamber with a base, during manufacturing the sealing chamber is internally equipped with a sensing medium and a pressure sensor chip, when the external pressure increases, the film bends towards an inner side of the sealing chamber to cause the sealing chamber to contract and transmit pressure to the pressure sensor chip through the sensing medium. The packaging structure of the present application can avoid the sensing chip from being damaged by excessive contraction of the sealing chamber due to pressure overload, and thus achieves overload protection.

公开(公告)号：US09773713B2

公开(公告)日：2017-09-26

申请号：US14804552

申请日：2015-07-21

申请人： SEIKO EPSON CORPORATION

发明人： Manabu Kondo

IPC分类号： H01R9/00 ,  H01L23/13 ,  B81C1/00 ,  H01L23/498 ,  H01L23/15

CPC分类号： H01L23/13 ,  B81C1/00261 ,  H01L23/15 ,  H01L23/49811 ,  H01L2224/48225 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311

摘要： To provide an electronic component in which the bonding position and bonding strength of a lead terminal can be maintained even if re-heated, a crystal oscillator as an electronic component includes: a first substrate having a connection terminal; and a lead terminal having a connection pad connected to the connection terminal of the first substrate via an electrically conductive bonding member. The electrically conductive bonding member has a part overlapping with the connection terminal and the connection pad, and a part arranged on the outside of the connection pad, as viewed in a plan view. The connection pad is provided with a first area overlapping with the connection terminal and a second area extending from the first area. The second area is connected to the first substrate via an insulative bonding member.

公开(公告)号：US09505610B2

公开(公告)日：2016-11-29

申请号：US14129541

申请日：2013-09-25

申请人： Weng Hong Teh ,  Tarek A Ibrahim ,  Sarah K Haney ,  Daniel N Sobieski ,  Parshuram B Zantye ,  Chad E Mair ,  Telesphor Kamgaing

发明人： Weng Hong Teh ,  Tarek A Ibrahim ,  Sarah K Haney ,  Daniel N Sobieski ,  Parshuram B Zantye ,  Chad E Mair ,  Telesphor Kamgaing

IPC分类号： H01L21/00 ,  B81C1/00

CPC分类号： B81C1/00246 ,  B81B2201/0271 ,  B81C1/00261 ,  B81C1/00277 ,  H01L21/568 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/73267 ,  H01L2924/01079

摘要： Techniques and mechanisms for providing precisely fabricated structures of a semiconductor package. In an embodiment, a build-up carrier of the semiconductor package includes a layer of porous dielectric material. Seed copper and plated copper is disposed on the layer of porous dielectric material. Subsequent etching is performed to remove copper adjacent to the layer of porous dielectric material, forming a gap separating a suspended portion of a MEMS structure from the layer of porous dielectric material. In another embodiment, the semiconductor package includes a copper structure disposed between portions of an insulating layer or portions of a layer of silicon nitride material. The layer of silicon nitride material couples the insulating layer to another insulating layer. One or both of the insulating layers are each protected from desmear processing with a respective release layer structure.

摘要翻译： 用于提供半导体封装的精确制造结构的技术和机构。 在一个实施例中，半导体封装的积聚载体包括多孔介电材料层。 种子铜和电镀铜设置在多孔电介质材料层上。 进行随后的蚀刻以去除邻近多孔介电材料层的铜，形成将MEMS结构的悬置部分与多孔介电材料层分开的间隙。 在另一个实施例中，半导体封装包括设置在绝缘层的一部分之间或者氮化硅材料层的一部分的铜结构。 氮化硅材料层将绝缘层耦合到另一绝缘层。 每个绝缘层中的一个或两个保护层不受去离子处理的剥离层结构的剥离。

公开(公告)号：US20160060108A1

公开(公告)日：2016-03-03

申请号：US14844779

申请日：2015-09-03

申请人： TEXAS INSTRUMENTS INCORPORATED

发明人： William Robert MORRISON ,  Mark Christopher FISHER ,  Murali Hanabe ,  Ganapathy Subramaniam SIVAKUMAR ,  Simon Joshua JACOBS

IPC分类号： B81C1/00

CPC分类号： B81C1/00984 ,  B81B3/0005 ,  B81B7/0032 ,  B81C1/00261 ,  B81C1/0096 ,  B81C2201/112 ,  H01L21/02112 ,  H04W4/02 ,  Y10S257/914

摘要： A device has a microelectromechanical system (MEMS) component with at least one surface and a coating disposed on at least a portion of the surface. The coating has a compound of the formula M(CnF2n+1Or), wherein M is a polar head group and wherein n≧2r. The value of n may range from 2 to about 20, and the value of r may range from 1 to about 10. The value of n plus r may range from 3 to about 30, and a ratio of n:r may have a value of about 2:1 to about 20:1.

摘要翻译： 器件具有微机电系统（MEMS）部件，其中至少一个表面和涂层设置在表面的至少一部分上。 该涂层具有式M（CnF2n + 10r）的化合物，其中M是极性头基，其中n≥2r。 n的值可以在2至约20的范围内，并且r的值可以在1至约10的范围内.n加r的值可以在3至约30的范围内，并且n：r的比可以具有值 为约2：1至约20：1。

公开(公告)号：US09213181B2

公开(公告)日：2015-12-15

申请号：US13474532

申请日：2012-05-17

申请人： Timothy J. Brosnihan ,  Mark B. Andersson ,  Eugene E. Fike, III ,  Joyce Wu ,  J. Lodewyk Steyn

发明人： Timothy J. Brosnihan ,  Mark B. Andersson ,  Eugene E. Fike, III ,  Joyce Wu ,  J. Lodewyk Steyn

IPC分类号： G02B26/00 ,  G02B26/02 ,  G09G3/34 ,  H01L23/544 ,  B81C1/00 ,  B81B7/00 ,  H01L23/00

CPC分类号： G02B26/02 ,  B81B7/0067 ,  B81B2201/038 ,  B81B2201/047 ,  B81C1/00 ,  B81C1/00039 ,  B81C1/00261 ,  B81C2203/054 ,  G09G3/3413 ,  G09G3/3433 ,  G09G3/3466 ,  G09G2320/041 ,  G09G2360/144 ,  H01L23/544 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/97 ,  H01L2223/54426 ,  H01L2224/1132 ,  H01L2224/114 ,  H01L2224/11462 ,  H01L2224/131 ,  H01L2224/16238 ,  H01L2224/2612 ,  H01L2224/29011 ,  H01L2224/32238 ,  H01L2224/73201 ,  H01L2224/81121 ,  H01L2224/81192 ,  H01L2224/81815 ,  H01L2224/83007 ,  H01L2224/83121 ,  H01L2924/01029 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/1461 ,  H01L2924/15788 ,  Y10T428/24157 ,  Y10T428/24744 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00

摘要： A display apparatus includes a first substrate, a plurality of microelectromechanical systems (MEMS) light modulators formed from a structural material coupled to the first substrate and a second substrate separated from the first substrate. A plurality of spacers extend from the first substrate to keep the second substrate a minimum distance away from the plurality of light modulators. The spacers include a first polymer layer having a surface in contact with the first substrate, a second polymer layer encapsulating the first polymer layer and a layer of the structural material encapsulating the second polymer layer. The spacers can be used as fluid barriers and configured to surround more than one but less than all of the MEMS light modulators in the display apparatus.

摘要翻译： 显示装置包括第一基板，由耦合到第一基板的结构材料形成的多个微机电系统（MEMS）光调制器和与第一基板分离的第二基板。 多个间隔件从第一基板延伸以使第二基板保持离开多个光调制器的最小距离。 间隔物包括具有与第一基底接触的表面的第一聚合物层，包封第一聚合物层的第二聚合物层和包封第二聚合物层的结构材料层。 间隔件可以用作流体屏障并且被配置为围绕显示装置中的多于一个但是不到所有的MEMS光调制器。

公开(公告)号：US20150303121A1

公开(公告)日：2015-10-22

申请号：US14790643

申请日：2015-07-02

申请人： TEXAS INSTRUMENTS INCORPORATED

发明人： Virgil C. Ararao

IPC分类号： H01L23/08 ,  H01L23/053 ,  H01L23/498 ,  H01L23/18 ,  H01L23/495 ,  H01L23/043 ,  H01L23/10

CPC分类号： B81B7/0038 ,  B81B7/0032 ,  B81B7/0064 ,  B81C1/00261 ,  B81C1/00333 ,  B81C2203/0109 ,  B81C2203/019 ,  H01L23/043 ,  H01L23/053 ,  H01L23/08 ,  H01L23/10 ,  H01L23/18 ,  H01L23/4952 ,  H01L23/49811 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/1815 ,  H01L2924/00

摘要： A hermetically packaged microelectromechanical system (MEMS) device has a substrate with an assembly pad (101) and a plurality of terminals (102); a chip (110) with a MEMS mechanical element (111) of a first height (111a) assembled on the pad and connected to the terminals by wires (120) with an insulating coat (121); a ridge (130) on the substrate, which surrounds the MEMS element (111) with a second height (130c) greater than the first height and comprises a plastic compound (131) filled with particles (132) and a surface (130a, 130b) having an adhering moisture-impermeable seal layer (133); and a moisture-impervious lid (140) attached to the ridge by moisture-proof bonds (150, 151), sealing the volume (160) enclosed by the lid, the chip, and the metalized ridge as a hermetic space for the MEMS element (111).

摘要翻译： 一种气密封装的微机电系统（MEMS）装置具有一个具有组件垫（101）和多个端子（102）的基板; 具有组装在所述焊盘上的第一高度（111a）的MEMS机械元件（111）的芯片（110），并通过具有绝缘涂层（121）的导线（120）连接到所述端子; 衬底上的脊（130），其围绕所述MEMS元件（111）具有大于所述第一高度的第二高度（130c），并且包括填充有颗粒（132）的塑料化合物（131）和表面（130a，130b） ）具有粘附的不透水密封层（133）; 以及通过防潮接合（150,151）附接到所述脊的防潮透气盖（140），将由所述盖，所述芯片和所述金属化脊包围的体积（160）密封为所述MEMS元件的密封空间 （111）。

公开(公告)号：US09102511B2

公开(公告)日：2015-08-11

申请号：US13914013

申请日：2013-06-10

申请人： TEXAS INSTRUMENTS INCORPORATED

发明人： Virgil C. Ararao

IPC分类号： B81C1/00 ,  B81B7/00

CPC分类号： B81B7/0038 ,  B81B7/0032 ,  B81B7/0064 ,  B81C1/00261 ,  B81C1/00333 ,  B81C2203/0109 ,  B81C2203/019 ,  H01L23/043 ,  H01L23/053 ,  H01L23/08 ,  H01L23/10 ,  H01L23/18 ,  H01L23/4952 ,  H01L23/49811 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/1815 ,  H01L2924/00

摘要： A hermetically packaged microelectromechanical system (MEMS) device has a substrate with an assembly pad (101) and a plurality of terminals (102); a chip (110) with a MEMS mechanical element (111) of a first height (111a) assembled on the pad and connected to the terminals by wires (120) with an insulating coat (121); a ridge (130) on the substrate, which surrounds the MEMS element (111) with a second height (130c) greater than the first height and comprises a plastic compound (131) filled with particles (132) and a surface (130a, 130b) having an adhering moisture-impermeable seal layer (133); and a moisture-impervious lid (140) attached to the ridge by moisture-proof bonds (150, 151), sealing the volume (160) enclosed by the lid, the chip, and the metalized ridge as a hermetic space for the MEMS element (111).

摘要翻译： 一种气密封装的微机电系统（MEMS）装置具有一个具有组件垫（101）和多个端子（102）的基板; 具有组装在所述焊盘上的第一高度（111a）的MEMS机械元件（111）的芯片（110），并通过具有绝缘涂层（121）的导线（120）连接到所述端子; 衬底上的脊（130），其围绕所述MEMS元件（111）具有大于所述第一高度的第二高度（130c），并且包括填充有颗粒（132）的塑料化合物（131）和表面（130a，130b） ）具有粘附的不透水密封层（133）; 以及通过防潮接合（150,151）附接到所述脊的防潮透气盖（140），将由所述盖，所述芯片和所述金属化脊包围的体积（160）密封为所述MEMS元件的密封空间 （111）。

公开(公告)号：US09053874B2

公开(公告)日：2015-06-09

申请号：US13623222

申请日：2012-09-20

申请人： Harris Corporation

发明人： John E. Rogers ,  Michael R. Weatherspoon

IPC分类号： H01L21/48 ,  H01H1/00 ,  H01H49/00 ,  H01H59/00

CPC分类号： H01H49/00 ,  B05D1/32 ,  B05D7/50 ,  B81C1/00261 ,  B81C1/00333 ,  H01H1/0036 ,  H01H59/0009 ,  Y10T29/42 ,  Y10T29/49105

摘要： Miniaturized devices such as MEMS switches (10) have encapsulating enclosures (100). The enclosure (100) and the remainder of the switch (10) are fabricated on a concurrent basis by depositing layers of an electrically-conductive material, such as copper, on a substrate (26).

摘要翻译： 诸如MEMS开关（10）的小型化器件具有封装外壳（100）。 壳体（100）和开关（10）的其余部分通过在衬底（26）上沉积导电材料（例如铜）的层而同时制造。

公开(公告)号：US20140374847A1

公开(公告)日：2014-12-25

申请号：US13922886

申请日：2013-06-20

申请人： Honeywell International Inc.

发明人： Albert Hrovat

IPC分类号： B81B3/00 ,  B81C1/00

CPC分类号： B81B3/0016 ,  B81B7/0048 ,  B81C1/0023 ,  B81C1/00261 ,  H01L2224/48227 ,  H01L2224/4899 ,  H01L2224/73265 ,  H01L2924/15311

摘要： In a method of packaging micro-electro-mechanical systems (MEMS) devices, an interposer board is provided having a first surface and an opposing second surface, with the interposer board including a plurality of electrical contacts on the second surface. A plurality of shim layers are bonded to the first surface of the interposer board, and a plurality of MEMS dies are each separately bonded to a respective one of the shim layers. Each of the MEMS dies are electrically connected to the interposer board by wire bonding. A plurality of covers are attached to the first surface of the interposer board over each of the MEMS dies to produce packaged MEMS devices. Each of the MEMS dies resides in a sealed cavity defined by a respective one of the covers and are substantially isolated from thermal stress.

摘要翻译： 在包装微电子机械系统（MEMS）装置的方法中，提供具有第一表面和相对的第二表面的中介板，其中插入板在第二表面上包括多个电接触。 多个垫片层结合到插入板的第一表面上，并且多个MEMS管芯分别结合到相应的一个垫片层。 每个MEMS管芯通过引线接合电连接到插入器板。 多个盖子通过每个MEMS管芯附接到插入器板的第一表面，以产生封装的MEMS器件。 每个MEMS管芯位于由相应的一个盖限定的密封腔中，并且基本上与热应力隔离。

公开(公告)号：US08916408B2

公开(公告)日：2014-12-23

申请号：US14022333

申请日：2013-09-10

申请人： Texas Instruments Incorporated

发明人： James R. Huckabee ,  Ray H. Purdom

IPC分类号： B81C1/00 ,  B81B3/00 ,  B81B7/00

CPC分类号： B81C1/00261 ,  B81B3/0081 ,  B81B7/0061 ,  B81B2201/0257 ,  B81B2201/0264 ,  H01L2224/45144 ,  H01L2224/48465 ,  H01L2924/1461 ,  H01L2924/3025 ,  H01L2924/00

摘要： A low-cost microelectromechanical system (MEMS) device has a mass-produced carrier fabricated as a pre-molded leadframe so that the space of the leadframe center is filled with compound and a two-tier stepped recess is created in the center. The first tier is filled by an inset with a first perforation and a second perforation. An integrated circuit chip with an opening and a membrane at the end of the opening, operable as a pressure sensor, microphone, speaker, etc, is assembled on the inset so that the chip opening is aligned with the first perforation. The chip is protected by a cover transected by a vent aligned with the second inset perforation. An air channel extends from the ambient exterior through the vent and the second perforation to the second tier recess, which acts as a channel and connects to the first perforation and the chip opening to the membrane.

摘要翻译： 低成本的微机电系统（MEMS）装置具有制造成预成型引线框架的质量生产的载体，使得引线框架中心的空间填充有复合物，并且在中心形成两层阶梯式凹槽。 第一层由具有第一穿孔和第二穿孔的插入物填充。 在开口端部具有开口和膜的集成电路芯片，可用作压力传感器，麦克风，扬声器等，组装在插图上，使得芯片开口与第一穿孔对准。 芯片由与第二插入孔对准的通气孔横切的盖保护。 空气通道从环境外部通过排气口和第二穿孔延伸到第二层凹槽，其作为通道并连接到第一穿孔和到膜的开口。