公开(公告)号：US20230343768A1

公开(公告)日：2023-10-26

申请号：US17992241

申请日：2022-11-22

Applicant: Google LLC

Inventor： Horia Alexandru Toma ,  Zuowei Shen ,  Hong Liu ,  Yujeong Shim ,  Biao He ,  Jaesik Lee ,  Georgios Konstadinidis ,  Teckgyu Kang ,  Igor Arsovski ,  Sukalpa Biswas

IPC: H01L25/16

CPC classification number: H01L25/167

Abstract: The technology generally relates to disaggregating memory from an application specific integrated circuit (“ASIC”) package. For example, a high-bandwidth memory (“HBM”) optics module package may be connected to an ASIC package via one or more optical links. The HBM optics module package may include HBM dies(s), HBM chiplet(s) and an optical chiplet. The optical chiplet may be configured to connect the HBM optics module to one or more optical fibers that form an optical link with one or more other components of the ASIC package. By including an optical chiplet in the HBM optics module package, the HBM optics module package may be disaggregated from an ASIC package.