公开(公告)号：US11650384B2

公开(公告)日：2023-05-16

申请号：US17668062

申请日：2022-02-09

Applicant: Google LLC

Inventor： William F. Edwards, Jr. ,  Melanie Beauchemin ,  Timothy Conrad Lee ,  Federico Pio Centola ,  Madhusudan K. Iyengar ,  Michael Chi Kin Lau ,  Zuowei Shen ,  Justin Sishung Lee

IPC: H04B10/00 ,  G02B6/42

CPC classification number: G02B6/4269 ,  G02B6/428 ,  G02B6/4284

Abstract: Heat dissipation and electric shielding techniques and apparatuses are disclosed to enable the operation of OSFP modules at higher bandwidths. OSFP compatible techniques are discussed including the use of water cooling, addition of heat pipes, use of intercoolers, air-fins and air-foils, optimization of cooling fins, use of vapor chambers are discussed.

公开(公告)号：US20250102746A1

公开(公告)日：2025-03-27

申请号：US18372989

申请日：2023-09-26

Applicant: Google LLC

Inventor： Horia Alexandru Toma ,  Zuowei Shen ,  Ilyas Mohammed ,  Yingying Wang ,  William F. Edwards, Jr.

IPC: G02B6/42 ,  H10B80/00

Abstract: The technology generally relates to high bandwidth memory (HBM) packages and processor packages that have optical connectivity. Disclosed systems and methods herein allow for HBM dies that are interconnected with an optical interface in a manner that allows for compact, high-performance computing. An HBM package can be cooled using a cooling unit that is distinct from the processor package. In addition, the cooling unit can be configured so as to provide thermal contact with a subset of high-power components within the HBM package.

公开(公告)号：US20240333411A1

公开(公告)日：2024-10-03

申请号：US18127103

申请日：2023-03-28

Applicant: Google LLC

Inventor： Benoit Lefebvre ,  Zuowei Shen ,  Hong Liu ,  Arjun Singh

IPC: H04J3/06 ,  H04Q11/00

CPC classification number: H04J3/0682 ,  H04Q11/0066 ,  H04Q2011/0079

Abstract: The technology is generally directed to programming delays in hardware already existing within fiber networks to reduce the unfairness in transmitting and receiving data. The delays may be programmed in the optics hardware after the deployment of the network. The delays may be determined based on the time it takes the networking switch to replicate data to be transmitted and/or the length of the cables. According to some examples, the delays may be programmed at either or both the egress and ingress optics hardware of a cable. The programmable delay reduces the unfairness of one destination, or end user, receiving data before another destination when the information is intended to be received synchronously.

公开(公告)号：US20230244046A1

公开(公告)日：2023-08-03

申请号：US18131640

申请日：2023-04-06

Applicant: Google LLC

Inventor： William F. Edwards, JR. ,  Melanie Beauchemin ,  Timothy Conrad Lee ,  Federico Pio Centola ,  Madhusudan K. Iyengar ,  Michael Chi Kin Lau ,  Zuowei Shen ,  Justin Sishung Lee

IPC: G02B6/42

CPC classification number: G02B6/4269 ,  G02B6/428 ,  G02B6/4284

Abstract: Heat dissipation and electric shielding techniques and apparatuses are disclosed to enable the operation of OSFP modules at higher bandwidths. OSFP compatible techniques are discussed including the use of water cooling, addition of heat pipes, use of intercoolers, air-fins and air-foils, optimization of cooling fins, use of vapor chambers are discussed.

公开(公告)号：US20230283364A1

公开(公告)日：2023-09-07

申请号：US17892498

申请日：2022-08-22

Applicant: Google LLC

Inventor： Zuowei Shen ,  Biao He ,  Hong Liu

IPC: H04B10/038 ,  H04B10/073

CPC classification number: H04B10/038 ,  H04B10/0731

Abstract: The technology generally relates to determining a status of an optical channel between two components. For example, the components may be connected via an optical link including a plurality of optical channels. A first portion of the optical channels may be in use such that a second portion of the optical channels may be redundant channels. The component may include a test generator that transmits and receives a data pattern over each channel. The test generator may determine, based on the received data pattern, a status of each of the channels. If the status of a given channel is a failure status, the component may divert data for the given channel to a redundant channel.

公开(公告)号：US20220269019A1

公开(公告)日：2022-08-25

申请号：US17668062

申请日：2022-02-09

Applicant: Google LLC

Inventor： William F. Edwards, JR. ,  Melanie Beauchemin ,  Timothy Conrad Lee ,  Federico Pio Centola ,  Madhusudan K. Iyengar ,  Michael Chi Kin Lau ,  Zuowei Shen ,  Justin Sishung Lee

IPC: G02B6/42

Abstract: Heat dissipation and electric shielding techniques and apparatuses are disclosed to enable the operation of OSFP modules at higher bandwidths. OSFP compatible techniques are discussed including the use of water cooling, addition of heat pipes, use of intercoolers, air-fins and air-foils, optimization of cooling fins, use of vapor chambers are discussed.

公开(公告)号：US20220003946A1

公开(公告)日：2022-01-06

申请号：US17122658

申请日：2020-12-15

Applicant: Google LLC

Inventor： William F. Edwards, Jr. ,  Melanie Beauchemin ,  Timothy Conrad Lee ,  Federico Pio Centola ,  Madhusudan K. Iyengar ,  Michael Chi Kin Lau ,  Zuowei Shen ,  Justin Sishung Lee

IPC: G02B6/42

Abstract: Heat dissipation and electric shielding techniques and apparatuses are disclosed to enable the operation of OSFP modules at higher bandwidths. OSFP compatible techniques are discussed including the use of water cooling, addition of heat pipes, use of intercoolers, air-fins and air-foils, optimization of cooling fins, use of vapor chambers are discussed.

公开(公告)号：US20250028661A1

公开(公告)日：2025-01-23

申请号：US18223332

申请日：2023-07-18

Applicant: Google LLC

Inventor： Horia Alexandru Toma ,  Zuowei Shen ,  William F. Edwards, JR. ,  Gurushankar Rajamani ,  Hong Liu ,  Ilyas Mohammed

IPC: G06F13/16

Abstract: The disclosure provides for high bandwidth processing through the sharing of memory dies over a plurality of computing dies via an optical interchange. The optical interchange may be configured so as to operate as both an optical switch and optical demultiplexer. The optical switch configuration for the optical interchange allows for data to be written from any computing die to one of a plurality of memory dies via an optical connection. The optical demultiplexer configuration allows for data to be broadcast from a memory die to a plurality of the computing dies.

公开(公告)号：US11956010B2

公开(公告)日：2024-04-09

申请号：US17892498

申请日：2022-08-22

Applicant: Google LLC

Inventor： Zuowei Shen ,  Biao He ,  Hong Liu

IPC: H04B10/00 ,  H04B10/038 ,  H04B10/073 ,  H04J14/00

CPC classification number: H04B10/038 ,  H04B10/0731

Abstract: The technology generally relates to determining a status of an optical channel between two components. For example, the components may be connected via an optical link including a plurality of optical channels. A first portion of the optical channels may be in use such that a second portion of the optical channels may be redundant channels. The component may include a test generator that transmits and receives a data pattern over each channel. The test generator may determine, based on the received data pattern, a status of each of the channels. If the status of a given channel is a failure status, the component may divert data for the given channel to a redundant channel.

公开(公告)号：US20240036278A1

公开(公告)日：2024-02-01

申请号：US17877041

申请日：2022-07-29

Applicant: Google LLC

Inventor： Horia Alexandru Toma ,  Zuowei Shen ,  Yujeong Shim ,  Teckgyu Kang ,  Jaesik Lee ,  Georgios Konstadinidis ,  Sukalpa Biswas ,  Hong Liu ,  Biao He

IPC: G02B6/42 ,  H01L23/367 ,  H01L23/473 ,  H01L25/16

CPC classification number: G02B6/4268 ,  G02B6/4274 ,  G02B6/4257 ,  H01L23/3675 ,  H01L23/473 ,  H01L25/167

Abstract: The technology generally relates to high bandwidth memory (HBM) and optical connectivity stacking. Disclosed systems and methods herein allow for 3D-stacking of HBM dies that are interconnected with an optical interface in a manner that allows for compact, high-performance computing. An optical chiplet can be configured to be placed onto a stack of HBM dies, with a cooling die that is positioned between the HBM dies and the optical chiplet. The optical chiplet may be configured to connect the HBM optics module package to one or more other components of the package via to one or more optical fibers.