ELECTRON MULTIPLIER
    1.
    发明申请

    公开(公告)号:US20210118655A1

    公开(公告)日:2021-04-22

    申请号:US16623511

    申请日:2018-04-10

    Abstract: The present embodiment relates to an electron multiplier having a structure configured to suppress and stabilize a variation of a resistance value in a wider temperature range. In the electron multiplier, a resistance layer sandwiched between a substrate and a secondary electron emitting layer comprised of an insulating material includes a metal layer in which a plurality of metal particles comprised of a metal material whose resistance value has a positive temperature characteristic are two-dimensionally arranged on a layer formation surface, which is coincident with or substantially parallel to a channel formation surface of the substrate, in the state of being adjacent to each other with a part of the first insulating material interposed therebetween, the metal layer having a thickness set to 5 to 40 angstroms.

    ELECTRON MULTIPLIER
    2.
    发明申请
    ELECTRON MULTIPLIER 审中-公开

    公开(公告)号:US20200176236A1

    公开(公告)日:2020-06-04

    申请号:US16624027

    申请日:2018-04-10

    Abstract: The present embodiment relates to an electron multiplier having a structure configured to suppress and stabilize a variation of a resistance value in a wider temperature range. In the electron multiplier, a resistance layer sandwiched between a substrate and a secondary electron emitting layer comprised of an insulating material is configured using a single metal layer in which a plurality of metal particles comprised of a metal material whose resistance value has a positive temperature characteristic are two-dimensionally arranged on a layer formation surface, which is coincident with or substantially parallel to a channel formation surface of the substrate, in the state of being adjacent to each other with a part of the first insulating material interposed therebetween.

    ELECTRON MULTIPLIER
    3.
    发明申请

    公开(公告)号:US20210134572A1

    公开(公告)日:2021-05-06

    申请号:US16623517

    申请日:2018-04-10

    Abstract: The present embodiment relates to an electron multiplier having a structure configured to suppress and stabilize a variation of a resistance value in a wider temperature range. The electron multiplier includes a resistance layer sandwiched between a substrate and a secondary electron emitting layer and configured using a Pt layer two-dimensionally formed on a layer formation surface which is coincident with or substantially parallel to a channel formation surface of the substrate. The resistance layer has a temperature characteristic within a range in which a resistance value at −60° C. is 10 times or less, and a resistance value at +60° C. is 0.25 times or more, relative to a resistance value at a temperature of 20° C.

    MICROCHANNEL PLATE AND ELECTRON MULTIPLIER TUBE

    公开(公告)号:US20200027709A1

    公开(公告)日:2020-01-23

    申请号:US16489004

    申请日:2018-01-23

    Abstract: A microchannel plate is provided with a substrate including a front surface, a rear surface, and a side surface, a plurality of channels penetrating from the front surface to the rear surface of the substrate, a first film provided on at least an inner wall surface of the channel, a second film provided on at least a part of the first film, and electrode layers provided on the front surface and the rear surface of the substrate. The first film is made of MgO, the second film is made of SiO2, and the second film is thinner than the first film.

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