公开(公告)号：US20170273169A1

公开(公告)日：2017-09-21

申请号：US15500056

申请日：2014-09-24

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Kevin D CONN ,  Harvey Edward WHITE ,  Gordon Scott REESE, SR.

IPC: H05K1/02 ,  G06F1/20

CPC classification number: H05K1/0203 ,  G06F1/20 ,  G06F1/206 ,  H05K7/20509

Abstract: Example implementations relate to a heat sink. For example, an implementation includes a heat sink including a main region to interface with an electronic device mounted to a printed circuit board. The heat sink also includes a load spreading bar coupled to the main region. The load spreading bar includes a first attachment region including a first attachment feature and a second attachment feature. The first attachment feature is to interface with an upper side of the printed circuit board and the second attachment feature is to interface with a lower side of the printed circuit board. The load spreading bar also includes a second attachment region to interface with the printed circuit board.