-
公开(公告)号:US20170215296A1
公开(公告)日:2017-07-27
申请号:US15328572
申请日:2014-07-30
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor: Pinche TSAI , Kevin D CONN , Mujeeb Ur REHMAN , Chanh V HUA
CPC classification number: H05K7/1487 , G06F1/183 , G06F13/4068 , G06F13/409 , G06F13/4282 , G06F2213/0024 , G06F2213/0026 , H01R12/716 , H05K7/1488
Abstract: A multi-bay apparatus can include a connector located in a multi-bay of a printed circuit assembly (PCA) of the apparatus, the connector is shaped to support a plurality of electronic input components at separate periods of time. The connector can connect an electronic input component among the plurality of electronic input components supported by the connector.
-
公开(公告)号:US20170273169A1
公开(公告)日:2017-09-21
申请号:US15500056
申请日:2014-09-24
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor: Kevin D CONN , Harvey Edward WHITE , Gordon Scott REESE, SR.
CPC classification number: H05K1/0203 , G06F1/20 , G06F1/206 , H05K7/20509
Abstract: Example implementations relate to a heat sink. For example, an implementation includes a heat sink including a main region to interface with an electronic device mounted to a printed circuit board. The heat sink also includes a load spreading bar coupled to the main region. The load spreading bar includes a first attachment region including a first attachment feature and a second attachment feature. The first attachment feature is to interface with an upper side of the printed circuit board and the second attachment feature is to interface with a lower side of the printed circuit board. The load spreading bar also includes a second attachment region to interface with the printed circuit board.
-
公开(公告)号:US20170325363A1
公开(公告)日:2017-11-09
申请号:US15118888
申请日:2014-02-14
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor: Pinche TSAI , Kevin D CONN
CPC classification number: H05K7/20836 , G06F1/185 , G06F1/187 , G06F1/20 , G06F2200/201 , H05K7/20 , H05K7/20145 , H05K7/20727 , H05K7/20772
Abstract: A blank cartridge includes an impedance portion to control a flow of cooling media through the blank cartridge to a plurality of computing components, and an actuator to change an impedance level of the impedance portion. The actuator receives a control signal to change the impedance level of the impedance portion based on a location of the plurality of computing components relative to the blank cartridge.
-
公开(公告)号:US20170295676A1
公开(公告)日:2017-10-12
申请号:US15511237
申请日:2014-09-29
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor: Kevin D CONN , Kelly K SMITH , Kapil Rao Papa Rao Bala GANTA, Sr.
IPC: H05K7/20
Abstract: A chassis in accordance with one example includes a plurality of slots to receive a plurality of top-loading computing cartridges from a top of the chassis. The chassis also includes a supply inlet on a first side of the chassis to direct cooling fluid from the first side to a second side of the chassis, and a return outlet on the second side of the chassis to expel the cooling fluid from the chassis. The plurality of computing cartridges are immersed in the cooling fluid.
-
公开(公告)号:US20170108891A1
公开(公告)日:2017-04-20
申请号:US15317116
申请日:2014-07-30
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor: Chanh V HUA , Michael STERNS , Kevin D CONN , Pinche TSAI
CPC classification number: G06F1/16 , G06F1/185 , H01R12/721
Abstract: Example implementations relate to a retention assembly. One example retention assembly includes a support member extending from a printed circuit board. The support member includes a body region having a slot and a first flange extending from the body region. The retention assembly also includes a locking member slidably coupled to the support member via the slot. The locking member includes a second flange. The second flange includes a protruded region, and wherein the protruded region and the first flange are to secure a proximal end of expansion module.
-
-
-
-