公开(公告)号：US20200285779A1

公开(公告)日：2020-09-10

申请号：US16291094

申请日：2019-03-04

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Martin Foltin ,  Aalap Tripathy ,  Harvey Edward White, JR. ,  John Paul Strachan

IPC: G06F21/76 ,  G06F21/55 ,  H04L29/06

Abstract: Examples described herein relate to a security system consistent with the disclosure. For instance, the security system may comprise a sensor interface bridge connecting a gateway to an input/output (I/O) card, a Field Programmable Gate Array (FPGA) to scan data to detect an anomaly in the data while the data is in the sensor interface bridge, where a learning neural network accelerator Application-Specific Integrated Circuit (ASIC) is integrated with the FPGA and send the data without an anomaly to the gateway.

公开(公告)号：US20220020660A1

公开(公告)日：2022-01-20

申请号：US16930877

申请日：2020-07-16

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Sunil Rao Ganta Papa Rao Bala ,  Matthew Kielbasa ,  Harvey Edward White, JR.

IPC: H01L23/367 ,  H01L23/34

Abstract: Examples include a computing system including a heater element for heating a processor device installed in the computing system. The computing system includes a chassis, a circuit board assembly housed in the chassis and a heat sink assembly disposed on the chassis to form a cover of the chassis. The circuit board assembly includes a processor package including a substrate having a first portion and a second portion. The processor package includes the processor device disposed on the first portion of the substrate. The heater element disposed on the second portion of the substrate. In the computing system, the heat sink assembly is disposed on the chassis such that a gap separates the heat sink assembly and the heater element.

公开(公告)号：US20210390070A1

公开(公告)日：2021-12-16

申请号：US16903286

申请日：2020-06-16

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Harvey Edward White, JR. ,  Aalap Tripathy ,  Martin Foltin ,  William Edward White

IPC: G06F13/40 ,  G06F13/42

Abstract: A universal industrial I/O interface bridge is provided. The universal industrial I/O interface bridge may be placed between a host and I/O interface cards to translate and manage electronic communications from these and other sources. Embodiments of the application may include (1) an improved hardware module, (2) an I/O discovery process to dynamically reprogram the universal industrial I/O interface bridge depending on the attached I/O card, (3) an abstraction process to illustrate the universal industrial I/O interface bridge and the physical I/O interfaces, (4) an alert plane within the universal industrial I/O interface bridge to respond to I/O alert pins, and (5) a secure distribution process for a firmware update of the universal industrial I/O interface bridge.

公开(公告)号：US20190327001A1

公开(公告)日：2019-10-24

申请号：US15958852

申请日：2018-04-20

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Harvey Edward White, JR. ,  Gerald K. Kleyn

IPC: H04B10/80 ,  H05K7/14 ,  H05K7/20

Abstract: A system includes a first server including a first optical communication system and a first control system, and a second server including a second optical communication system and a second control system. The first and second control systems optically communicates with each other using the first and second optical communication systems, and the second control system is configured to control a temperature of the first and second servers by controlling airflow from the first server to the second server.