公开(公告)号：US11738508B2

公开(公告)日：2023-08-29

申请号：US16756364

申请日：2017-11-17

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Sterling Chaffins ,  Kevin P DeKam ,  Kristopher J Erickson ,  Cory J Ruud ,  Jami Ryan Barone ,  Ruhua Cai ,  Anthony J Galvan

IPC: B29C64/165 ,  C08K3/08 ,  C08L77/02 ,  B33Y10/00 ,  B33Y70/00 ,  C08K3/04

CPC classification number: B29C64/165 ,  C08K3/08 ,  C08L77/02 ,  B33Y10/00 ,  B33Y70/00 ,  C08K3/042 ,  C08K2003/0806 ,  C08K2201/001 ,  C08K2201/005

Abstract: In an example, a composition for three-dimensional (3D) printing includes a polymer build material and a non-conductive fusing agent dispensable onto the polymer build material to form a polymer-fusing agent composite portion when heated to a sintering temperature, a conductive agent dispensable onto on the polymer build material to form a polymer-conductive agent composite portion when heated at least to the sintering temperature, the conductive agent comprising: at least one conductive particulate present in an amount of from about 10% to about 60% of a total weight of the conductive agent; at least one co-solvent present in an amount of from about 10% to about 50% of a total weight of the conductive agent; and an additive present in an amount of from about 0% to about 10% of a total weight of the conductive agent.