公开(公告)号：US12127469B2

公开(公告)日：2024-10-22

申请号：US18070761

申请日：2022-11-29

申请人： E Ink Corporation

发明人： Nishit Murari

IPC分类号： H10K71/00 ,  C08J3/075 ,  C08J3/24 ,  C08K3/04 ,  C08K3/16 ,  C08K3/22 ,  G02F1/13 ,  G02F1/167 ,  G02F1/16757 ,  H01B1/04 ,  H01B1/12 ,  H01L27/142 ,  H01L31/0392 ,  H10K59/88 ,  H10K77/10 ,  G02F1/1343 ,  G02F1/1676 ,  H01L31/0224 ,  H10K85/10 ,  H10K85/20 ,  H10K102/00

CPC分类号： H10K71/861 ,  C08J3/075 ,  C08J3/24 ,  C08K3/04 ,  C08K3/16 ,  C08K3/22 ,  G02F1/1306 ,  G02F1/167 ,  G02F1/16757 ,  H01B1/04 ,  H01B1/124 ,  H01L27/142 ,  H01L31/03926 ,  H10K59/88 ,  H10K77/111 ,  B32B2457/20 ,  C08J2305/04 ,  C08J2329/04 ,  C08K2003/162 ,  C08K2003/2237 ,  C08K2003/2244 ,  C08K2201/001 ,  C08K2201/014 ,  G02F1/13439 ,  G02F1/1676 ,  H01L31/022425 ,  H10K85/10 ,  H10K85/221 ,  H10K2102/311

摘要： A multi-layer device and its method of manufacture are disclosed. The multi-layer device comprises a first electrode layer, a first repair layer, a functional layer, and a second electrode layer. The first repair layer comprises a conductive hydrogel film or conductive hydrogel beads, the conductive hydrogel film or the conductive hydrogel beads comprising conductive filler particles dispersed in a cross-linked polymer. The repair layer protects the multi-layer device from electrical short circuits. A multi-layer device is also disclosed including a light-transmissive electrode layer comprising a porous mesh or porous spheres.

公开(公告)号：US20240343963A1

公开(公告)日：2024-10-17

申请号：US18579964

申请日：2022-07-12

申请人： Solvay Specialty Polymers USA, LLC

发明人： Emmanuel ANIM-DANSO ,  Lee CARVELL ,  Stéphane JEOL

IPC分类号： C09K5/14 ,  C08K3/38 ,  C08K7/06

CPC分类号： C09K5/14 ,  C08K3/38 ,  C08K7/06 ,  C08K2003/385 ,  C08K2201/001

摘要： Polymer compositions are provided, and articles made therefrom. The polymer compositions comprise from 25 to 50 wt. % of a thermoplastic polymer; from 10 to 45 wt. % of a thermally conductive filler; from 15 to 30 wt. % of an electrically conductive carbon fiber; and less than 5 wt. % additives. The polymer composition is substantially free of glass fibers. The polymer compositions described herein surprisingly exhibit significantly improved thermal conductivity relative to analogous polymer compositions in which the carbon fiber is replaced by glass fiber. Further, even though carbon fiber has a significantly higher electrical conductivity relative to glass fiber, the polymer compositions exhibit no appreciable loss of volume resistivity relative to analogous polymer compositions in which carbon fiber is replaced by glass fiber.

公开(公告)号：US20240343928A1

公开(公告)日：2024-10-17

申请号：US18633960

申请日：2024-04-12

申请人： Molecular Rebar Design, LLC

发明人： Clive Paul Bosnyak

IPC分类号： C09D7/62 ,  B33Y70/10 ,  C08K3/013 ,  C08K3/02 ,  C08K3/22 ,  C08K9/08 ,  C09D7/40 ,  H01F1/14 ,  H01M4/02 ,  H01M4/36 ,  H01M4/38 ,  H01M4/525 ,  H01M4/62

CPC分类号： C09D7/62 ,  B33Y70/10 ,  C09D7/69 ,  C09D7/70 ,  H01F1/14 ,  H01M4/366 ,  H01M4/386 ,  H01M4/525 ,  H01M4/625 ,  C08K3/013 ,  C08K2003/023 ,  C08K2003/2293 ,  C08K9/08 ,  C08K2201/001 ,  C08K2201/003 ,  C08K2201/004 ,  C08K2201/01 ,  C08K2201/011 ,  H01M2004/027 ,  H01M2004/028

摘要： Novel coating compositions are disclosed for use in Energy Storage devices and Additive Manufacturing. The coatings are comprised of discrete carbon nanotubes wherein the coatings have a selected range of porosity, and optionally the discrete carbon nanotubes have selected surface modifications to improve wetting or flow of material through the pores of the carbon nanotube coating. The coatings have less than about 20% mass of bundles or ropes of carbon nanotubes with a dimension larger than about 5 micrometers The coatings are of average thickness from about 5 nanometers to about 2000 nanometers and can be applied onto particles of diameter less than about 1000 micrometers, or films. Improved energy storage, or additive part performances include, but not limited to, higher electron conductivity for electrodes of energy storage devices, and higher electron conductivity for parts made by additive manufacturing. The coatings are particularly suitable for additive manufacturing of energy storage devices, and electrodes made using a dry electrode process.

公开(公告)号：US20240304356A1

公开(公告)日：2024-09-12

申请号：US18275402

申请日：2022-02-02

申请人： NEXANS

发明人： Christelle MAZEL ,  Gabriele PEREGO ,  Daphné MERLE ,  Claire GRANGER

IPC分类号： H01B3/44 ,  C08K5/01 ,  C08K7/00 ,  C08K13/02 ,  H01B3/22 ,  H01B7/42

CPC分类号： H01B3/441 ,  C08K5/01 ,  C08K7/00 ,  C08K13/02 ,  H01B3/22 ,  H01B7/428 ,  C08K2201/001 ,  C08K2201/005 ,  C08K2201/006

摘要： The invention relates to a cable comprising at least one electrically insulating layer obtained from a polymer composition comprising at least one thermoplastic polymer material based on polypropylene, at least one dielectric liquid, at least a first thermally conductive inorganic filler having a morphology M1 and at least a second thermally conductive inorganic filler having a morphology M2 different from M1.

公开(公告)号：US20240294758A1

公开(公告)日：2024-09-05

申请号：US18566236

申请日：2022-05-31

申请人： Shin-Etsu Chemical Co., Ltd.

发明人： Junichi TSUKADA

IPC分类号： C08L83/04 ,  C08K5/3475

CPC分类号： C08L83/04 ,  C08K5/3475 ,  C08K2201/001

摘要： Provided is a thermally conductive silicone composition capable of being turned into a cured product that is superior in heat dissipation property and is able to suppress corrosion of metal wirings. The thermally conductive silicone composition contains:



(A) an organopolysiloxane having at least 2 silicon atom-bonded alkenyl groups per molecule, and having a kinetic viscosity of 10 to 100,000 mm2/s at 25° C.;
(B) an organohydrogenpolysiloxane having, per molecule, at least 2 hydrogen atoms that are directly bonded to silicon atoms;
(C) a thermally conductive filler having a thermal conductivity of not lower than 10 W/m·K;
(D) a dimethylpolysiloxane with one molecular chain end being blocked by a trialkoxy group;
(E) a platinum group metal-based curing catalyst;
(F) benzotriazole and/or a benzotriazole derivative; and
(G) an aliphatic unsaturated bond-free organopolysiloxane.

公开(公告)号：US20240291021A1

公开(公告)日：2024-08-29

申请号：US18572157

申请日：2022-12-08

申请人： LG ENERGY SOLUTION, LTD.

发明人： Jung Pil LEE ,  Hyeaeun HAN ,  Dong Kyu KIM ,  Sunwook HWANG

IPC分类号： H01M10/056 ,  C08K3/105 ,  C08K5/00 ,  C09D5/24 ,  C09D165/00 ,  C09D179/04 ,  H01M4/13 ,  H01M4/62

CPC分类号： H01M10/056 ,  C09D5/24 ,  C09D165/00 ,  C09D179/04 ,  H01M4/13 ,  H01M4/62 ,  C08K3/105 ,  C08K5/0091 ,  C08K2201/001 ,  H01M2300/0065 ,  H01M2300/0091

摘要： A solid electrolyte and a method for preparing the same are provided. The solid electrolyte includes a conducting polymer having mixed conducting characteristics; and a lithium salt, and the mixed conducting characteristics include ionic conductivity and electrical conductivity.

公开(公告)号：US20240287244A1

公开(公告)日：2024-08-29

申请号：US18024386

申请日：2022-08-08

申请人： SHIN-ETSU CHEMICAL CO., LTD.

发明人： Shiori NONAKA ,  Koji HASEGAWA ,  Osamu WATANABE

IPC分类号： C08G18/83 ,  C08K3/08

CPC分类号： C08G18/831 ,  C08K3/08 ,  C08K2003/0806 ,  C08K2003/085 ,  C08K2201/001 ,  C08K2201/005

摘要： A polyurethane contains a phenolic hydroxyl group represented by the following general formula (1A). Thus, the present invention provides: a conductive paste composition for forming a stretchable conductive wire which varies slightly in electric conductivity at the time of elongation and shrinkage; and a polyurethane providing the composition.

公开(公告)号：US12065607B1

公开(公告)日：2024-08-20

申请号：US18395733

申请日：2023-12-25

申请人： SICHUAN UNIVERSITY

发明人： Junwen Ren ,  Zi Wang ,  Shenli Jia ,  Lihua Zhao ,  Huachao Wei ,  Lichuan Jia ,  Guoqing Jiang ,  Ruichi Zeng

IPC分类号： C09K5/14 ,  C08J3/205 ,  C08K3/38 ,  C08K9/02 ,  C08K9/04 ,  C09C3/00 ,  C09C3/04 ,  C09C3/08 ,  C09K9/00

CPC分类号： C09K5/14 ,  C08J3/2056 ,  C08K9/02 ,  C08K9/04 ,  C09C3/006 ,  C09C3/048 ,  C09C3/08 ,  C09K9/00 ,  C01P2004/03 ,  C01P2004/24 ,  C01P2006/32 ,  C08J2383/04 ,  C08K2003/385 ,  C08K2201/001 ,  C08K2201/011

摘要： A silicone rubber composite heat dissipation pad and a preparation method thereof are provided. The method includes: dispersing hydroxyl-functionalized boron nitride nanosheet powder into deionized water, pouring it into a specialized container, pre-freezing it using liquid nitrogen, and then freeze-drying it to obtain a boron nitride nanosheet skeleton arranged in a horizontal direction; uniformly dispersing thermochromic nanoparticles in acetone to obtain a dispersion, mixing the dispersion with liquid silicone rubber and stirring until acetone is completely evaporated, then adding a curing agent to obtain a liquid silicone rubber pre-cure solution; pouring the liquid silicone rubber pre-cure solution into a container containing the boron nitride nanosheet skeleton, so that the liquid silicone rubber pre-cure solution is fully immersed in an interior of the boron nitride nanosheet skeleton; and then curing is carried out by elevating the temperature to obtain the heat dissipation pad.

公开(公告)号：US12064949B2

公开(公告)日：2024-08-20

申请号：US17040045

申请日：2019-04-12

申请人： artience Co., Ltd. ,  TOYO INK CO., LTD.

发明人： Kouichi Tosaki ,  Atsushi Nakazato

IPC分类号： B32B7/025 ,  B29C45/16 ,  B32B27/08 ,  B32B27/18 ,  C08J5/12 ,  C08J5/18 ,  C08K3/04 ,  C08K3/08 ,  C08K3/22 ,  C08K9/02 ,  C09D11/033 ,  C09D11/037 ,  C09D11/102 ,  C09D11/104 ,  C09D11/107 ,  C09D11/52 ,  H01B1/22 ,  H05K3/10 ,  B29K669/00

CPC分类号： B32B7/025 ,  B29C45/1679 ,  B32B27/08 ,  B32B27/18 ,  C08J5/121 ,  C08J5/18 ,  C08K3/04 ,  C08K3/08 ,  C08K3/22 ,  C08K9/02 ,  C09D11/033 ,  C09D11/037 ,  C09D11/102 ,  C09D11/104 ,  C09D11/107 ,  C09D11/52 ,  H01B1/22 ,  H05K3/103 ,  B29K2669/00 ,  B32B2264/102 ,  B32B2264/1051 ,  B32B2264/1055 ,  C08J2333/00 ,  C08J2363/00 ,  C08J2367/02 ,  C08J2375/06 ,  C08K2003/0806 ,  C08K2003/085 ,  C08K2003/2231 ,  C08K2201/001

摘要： Provided is a conductive composition for molded film that enables production of a molded film for which tensile force-induced reductions in conductivity are suppressed. The conductive composition for molded film contains a resin (A), conductive fine particles (B), and a solvent (C), wherein the solvent (C) contains, in 100 parts by mass of the solvent (C), at least 40 parts by mass of a solvent (C′) that satisfies the following condition (1) and condition (2). (1) A boiling point of 180° C. to 270° C. (2) At least one of the following is satisfied: the polar parameter δp of the Hansen solubility parameter (HSP) is 0≤δp≤5.0, and the hydrogen-bond parameter δh of the Hansen solubility parameter (HSP) is 9.8≤δh≤4.0.

公开(公告)号：US20240270982A1

公开(公告)日：2024-08-15

申请号：US18572144

申请日：2022-06-30

申请人： AEROGEL APS

发明人： Eva WALLSTRÖM

IPC分类号： C09D5/16 ,  A01N25/04 ,  A01N25/28 ,  A01P15/00 ,  C08K3/36 ,  C09D5/14

CPC分类号： C09D5/1687 ,  A01N25/04 ,  A01N25/28 ,  A01P15/00 ,  C08K3/36 ,  C09D5/14 ,  C08K2201/001

摘要： The present invention relates to silica aerogels with a high to very high loading (55-90% w/w) of encapsulated biocidal and/or biorepellant compounds, high porosity and low thermal conductivity and to methods of making and using such aerogels in antifouling compositions, which are especially suitable for both onshore and offshore coatings (marine paints, coatings, sealants, lacquers, wood protection or similar controlled leaching systems) that are naturally exposed to humid conditions and/or water, including sea water, and thus prone to fouling.