公开(公告)号：US20240343886A1

公开(公告)日：2024-10-17

申请号：US18418625

申请日：2024-01-22

申请人： T&L Health Care Corp.

发明人： Do Gi PYUN ,  In Me KIM

IPC分类号： C08K3/08 ,  C08J5/18 ,  C08L75/04 ,  C09D5/24

CPC分类号： C08K3/08 ,  C08J5/18 ,  C08L75/04 ,  C09D5/24 ,  C08K2003/0806 ,  C08K2201/011

摘要： The present disclosure relates to a stretching electrode in which silver nanowires AgNHs, silver microparticles AgMPs, and silver nanoparticles AgNPs are included in a heat-resistant thermosetting resin, the silver nanowires AgNWs have a positive charge (+) and the silver nanoparticles AgNPs have a negative charge (−), and the heat-resistant thermosetting resin is a polyurethane resin.

公开(公告)号：US20240336755A1

公开(公告)日：2024-10-10

申请号：US18630239

申请日：2024-04-09

申请人： EVOQ NANO, INC.

发明人： William H. NIEDERMEYER

IPC分类号： C08J7/06 ,  C08J3/20 ,  C08J3/205 ,  C08K3/08 ,  C08K7/18

CPC分类号： C08J7/06 ,  C08J3/203 ,  C08J3/2053 ,  C08J7/08 ,  C08K3/08 ,  C08K7/18 ,  C08J2300/24 ,  C08K2003/0806 ,  C08K2003/0831 ,  C08K2201/003 ,  C08K2201/013

摘要： Disclosed are polymer compositions incorporating metal nanoparticles and medical devices or other products made therefrom. The disclosed polymer compositions can be utilized to form medical devices, including implantable medical devices, with effective antimicrobial properties. The disclosed polymer compositions incorporate metal nanoparticles that function without the release of metal (e.g., silver) ions. The polymer compositions may have anti-UV properties imparted by metal nanoparticles.

公开(公告)号：US12084562B2

公开(公告)日：2024-09-10

申请号：US17416961

申请日：2019-11-25

申请人： TOYO SEIKAN GROUP HOLDINGS, LTD. ,  TOYO SEIKAN CO., LTD.

发明人： Tomokazu Kobayashi ,  Daisuke Imoda ,  Shuji Nakano

IPC分类号： H01M50/193 ,  C08K3/08 ,  C08K5/098 ,  C08K9/04 ,  H01M10/0562 ,  H01M10/52 ,  H01M50/141 ,  H01M50/191 ,  H01M50/195 ,  H01M50/197

CPC分类号： C08K9/04 ,  C08K3/08 ,  C08K5/098 ,  H01M10/0562 ,  H01M10/52 ,  H01M50/141 ,  H01M50/191 ,  H01M50/193 ,  H01M50/195 ,  H01M50/197 ,  C08K2003/0806 ,  H01M2300/0068

摘要： A sealer for use in an all-solid-state secondary battery provided with a sulfur-containing solid electrolyte, characterized in that the sealer contains a resin and a particulate fatty acid metal salt dispersed in the resin, and the particulate fatty acid metal salt is a particulate fatty acid metal salt in which a fatty acid is coordinated on the surfaces of the metal particles having a mean particle diameter of not more than 1000 nm. The all-solid-state secondary battery is capable of suppressing the generation of the hydrogen sulfide.

公开(公告)号：US20240287244A1

公开(公告)日：2024-08-29

申请号：US18024386

申请日：2022-08-08

申请人： SHIN-ETSU CHEMICAL CO., LTD.

发明人： Shiori NONAKA ,  Koji HASEGAWA ,  Osamu WATANABE

IPC分类号： C08G18/83 ,  C08K3/08

CPC分类号： C08G18/831 ,  C08K3/08 ,  C08K2003/0806 ,  C08K2003/085 ,  C08K2201/001 ,  C08K2201/005

摘要： A polyurethane contains a phenolic hydroxyl group represented by the following general formula (1A). Thus, the present invention provides: a conductive paste composition for forming a stretchable conductive wire which varies slightly in electric conductivity at the time of elongation and shrinkage; and a polyurethane providing the composition.

公开(公告)号：US12064949B2

公开(公告)日：2024-08-20

申请号：US17040045

申请日：2019-04-12

申请人： artience Co., Ltd. ,  TOYO INK CO., LTD.

发明人： Kouichi Tosaki ,  Atsushi Nakazato

IPC分类号： B32B7/025 ,  B29C45/16 ,  B32B27/08 ,  B32B27/18 ,  C08J5/12 ,  C08J5/18 ,  C08K3/04 ,  C08K3/08 ,  C08K3/22 ,  C08K9/02 ,  C09D11/033 ,  C09D11/037 ,  C09D11/102 ,  C09D11/104 ,  C09D11/107 ,  C09D11/52 ,  H01B1/22 ,  H05K3/10 ,  B29K669/00

CPC分类号： B32B7/025 ,  B29C45/1679 ,  B32B27/08 ,  B32B27/18 ,  C08J5/121 ,  C08J5/18 ,  C08K3/04 ,  C08K3/08 ,  C08K3/22 ,  C08K9/02 ,  C09D11/033 ,  C09D11/037 ,  C09D11/102 ,  C09D11/104 ,  C09D11/107 ,  C09D11/52 ,  H01B1/22 ,  H05K3/103 ,  B29K2669/00 ,  B32B2264/102 ,  B32B2264/1051 ,  B32B2264/1055 ,  C08J2333/00 ,  C08J2363/00 ,  C08J2367/02 ,  C08J2375/06 ,  C08K2003/0806 ,  C08K2003/085 ,  C08K2003/2231 ,  C08K2201/001

摘要： Provided is a conductive composition for molded film that enables production of a molded film for which tensile force-induced reductions in conductivity are suppressed. The conductive composition for molded film contains a resin (A), conductive fine particles (B), and a solvent (C), wherein the solvent (C) contains, in 100 parts by mass of the solvent (C), at least 40 parts by mass of a solvent (C′) that satisfies the following condition (1) and condition (2). (1) A boiling point of 180° C. to 270° C. (2) At least one of the following is satisfied: the polar parameter δp of the Hansen solubility parameter (HSP) is 0≤δp≤5.0, and the hydrogen-bond parameter δh of the Hansen solubility parameter (HSP) is 9.8≤δh≤4.0.

公开(公告)号：US11945931B1

公开(公告)日：2024-04-02

申请号：US18280250

申请日：2021-12-01

申请人： SUZHOU INSTITUTE OF NANO-TECH AND NANO-BIONICS (SINANO), CHINESE ACADEMY OF SCIENCES

发明人： Weibang Lv ,  Shuxuan Qu ,  Jiaqi Xi

IPC分类号： C08K3/04 ,  C08K3/08 ,  C08K3/22 ,  C08K3/38 ,  C08K7/06 ,  C08K9/00

CPC分类号： C08K3/041 ,  C08K3/08 ,  C08K3/22 ,  C08K3/38 ,  C08K7/06 ,  C08K9/00 ,  C08K2003/0806 ,  C08K2003/2227 ,  C08K2003/385 ,  C08K2201/001 ,  C08K2201/011 ,  Y02W30/62

摘要： A recyclable nano composite, a preparation method, and an application thereof are provided. The preparation method includes providing a reinforcement material including a conductive material, or, a combination of the conductive material and an insulating material; directly mixing the reinforcement material with a matrix material, or, molding the reinforcement material to form a film, fiber or three-dimensional network structure formed by the reinforcement material, and then compounding the film, fiber or three-dimensional network structure with the matrix material to obtain the recyclable nano composite. The present disclosure further discloses a recycling method of a reinforcement material. The recyclable nano composite provided by the present disclosure has high strength, high toughness, conductivity, electromagnetic shielding and other properties; furthermore, by simple treatment, the reinforcement material can be recycled.

公开(公告)号：US11912897B2

公开(公告)日：2024-02-27

申请号：US17044146

申请日：2019-02-18

申请人： Tatsuta Electric Wire & Cable Co., Ltd.

发明人： Hajime Nakazono ,  Kazuhiro Matsuda

IPC分类号： C09D5/24 ,  C09D7/61 ,  C08K3/08 ,  C08K5/00 ,  C09D163/00 ,  H01L21/56 ,  H01L21/78 ,  H01L23/552 ,  H01B1/22 ,  H05K9/00 ,  C09D7/20 ,  C08G59/40 ,  C08K5/56 ,  H01L23/31

CPC分类号： C09D5/24 ,  C08G59/4028 ,  C08K3/08 ,  C08K5/0091 ,  C08K5/56 ,  C09D7/20 ,  C09D7/61 ,  C09D163/00 ,  H01B1/22 ,  H01L21/56 ,  H01L21/78 ,  H01L23/552 ,  H05K9/00 ,  H05K9/0075 ,  C08K2003/085 ,  C08K2003/0806 ,  H01L23/3121 ,  C09D163/00 ,  C08K3/08 ,  C09D163/00 ,  C08K9/02

摘要： The present invention provides a conductive coating material curable at low temperatures. The present invention relates to a conductive coating material containing: 100 parts by weight of an epoxy resin-containing binder component (A); 500 to 2500 parts by weight of metal particles (B); 1 to 150 parts by weight of a curing agent (C); 20 to 800 parts by weight of a solvent (D); and 0.5 to 5 parts by weight of a curing catalyst (E).

公开(公告)号：US20240059832A1

公开(公告)日：2024-02-22

申请号：US18269416

申请日：2021-12-24

申请人： Resonac Corporation

发明人： Jun KUWAHARA ,  Shigeru YAMAKI

IPC分类号： C08G63/664 ,  C08J5/18 ,  C08K3/08 ,  C08K7/00

CPC分类号： C08G63/664 ,  C08J5/18 ,  C08K3/08 ,  C08K7/00 ,  C08K2003/0806 ,  C08K2201/011

摘要： Provided is a transparent conducting film laminate suitable for three-dimensional molding having a curved surface. A transparent conducting film laminate comprising: a transparent substrate made of a transparent thermoplastic resin film, a transparent conducting film formed on at least one main face of the transparent substrate, and containing a binder resin and a metal nanowire, and a protection film formed on the transparent conducting film, and containing a resin component, wherein the binder resin contains at least on kind of poly-N-vinylacetamide, a copolymer containing 70 mol % or more of N-vinylacetamide (NVA) as a monomer unit, and a cellulose-based resin, and 94% by mass or more of the resin component constituting the protection film is derived from a thermoplastic resin.

公开(公告)号：US11891505B2

公开(公告)日：2024-02-06

申请号：US16863297

申请日：2020-04-30

申请人： FUJIFILM Corporation

发明人： Kazuhiro Hamada ,  Kazushi Furukawa ,  Yoshihiro Nakai

IPC分类号： C08L63/00 ,  C08K5/17 ,  C08G59/50 ,  G01N29/24 ,  G10K11/18 ,  G10K11/36 ,  C08K3/08

CPC分类号： C08L63/00 ,  C08G59/5033 ,  G01N29/2437 ,  G10K11/18 ,  G10K11/36 ,  C08K5/17 ,  C08K2003/085 ,  C08K2003/0806 ,  C08K2003/0856 ,  C08K2003/0862 ,  C08K2003/0887 ,  C08K2003/0893 ,  C08K5/17 ,  C08L63/00

摘要： Provided is a resin composition for an acoustic matching layer, the resin composition including an epoxy resin (A), a specific polyamine compound (B), and metal particles (C). The epoxy resin (A) includes at least one epoxy resin selected from the group consisting of bisphenol A epoxy resins, bisphenol F epoxy resins, and phenol novolac epoxy resins. Also provided are a cured product formed of the composition, an acoustic matching sheet, an acoustic probe, an acoustic measuring apparatus, a method for producing an acoustic probe, and an acoustic matching layer material set.

公开(公告)号：US20230360820A1

公开(公告)日：2023-11-09

申请号：US18022883

申请日：2021-09-15

申请人： Mitsui Mining & Smelting Co., Ltd.

发明人： Kentaro OCHI

IPC分类号： B22F1/054 ,  C25C1/20 ,  C08K3/08 ,  H01B1/22 ,  B22F1/10

CPC分类号： H01B1/22 ,  B22F1/0553 ,  B22F1/056 ,  B22F1/10 ,  C08K3/08 ,  C25C1/20 ,  B22F2301/255 ,  B22F2304/054 ,  B22F2999/00 ,  C08K2003/0806 ,  C08K2201/001 ,  C08K2201/003 ,  C08K2201/011

摘要： A silver powder containing dendrite silver particles is provided. The dendrite silver particles are in a dendrite shape having one trunk and a plurality of branches branching from the trunk. The thickness of the trunk of the dendrite silver particles is from 10 to 280 nm. The number of the branches per length of the trunk is from 6 to 30 branches/µm. The percentage by number of the dendrite silver particles in the whole of silver particles is 50 N% or more. This silver powder is produced by reducing silver ions through electrolysis of an electrolyte solution containing silver ions and hydantoin or a derivative thereof.