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公开(公告)号:US20220274163A1
公开(公告)日:2022-09-01
申请号:US17637635
申请日:2019-11-15
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: John Samuel Dilip Jangam , Kristopher Erickson , Thomas Craig Anthony , Lihua Zhao
Abstract: The present disclosure relates to a method of three-dimensional (3D) printing a 3D printed metal object. The method comprises selectively jetting an alloying agent onto build material. The build material comprises a first metal and the alloying agent comprises an alloying component that forms an alloy with the first metal. The method also comprises selectively jetting a binding agent onto the build material; binding the build material to form a layer: the alloying component is incorporated in the 3D object in a predetermined arrangement that comprises a first and a second region. The first region comprises the alloying component and the second region is substantially free from the alloying component or comprises the alloying component at a lower concentration than the first regions. The disclosure also relates to a kit that may be used in the method and a 3D printed structure that may be formed using the method.
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公开(公告)号:US20230076796A1
公开(公告)日:2023-03-09
申请号:US17921335
申请日:2020-04-29
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Kyle Wycoff , Emre Hiro Discekici , John Samuel Dilip Jangam , Thomas Craig Anthony
Abstract: The present disclosure relates to a kit for 3D printing a 3D printed metal object. The kit comprises build material comprising metal particles; and a binding agent. The binding agent comprises a hydrated metal salt having a dehydration temperature of from 100 to about 250° C., and water. The binding agent may be either free from organic solvent and surfactant, or the binding agent comprises organic solvent and/or surfactant and the total amount of organic solvent and/or surfactant is less than 3 weight % based on the total weight of the binding agent.
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公开(公告)号:US12145315B2
公开(公告)日:2024-11-19
申请号:US17779729
申请日:2019-12-11
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Aja Hartman , John Samuel Dilip Jangam , Wei Huang , Thomas Craig Anthony , Gary J Dispoto , Lihua Zhao
IPC: B29C64/264 , B29C64/153 , B29C64/255 , B33Y10/00 , B33Y30/00 , B33Y70/10
Abstract: The present disclosure relates to a three-dimensional printing kit comprising: a powder bed material comprising polymer particles; a fusing agent comprising a radiation absorber and a liquid carrier; and a magnetic marking agent comprising magnetic nanoparticles, a humectant and a liquid carrier, wherein the concentration of magnetic nanoparticles is 5 to 70 weight % based on the total weight of the magnetic agent. The present disclosure also relates to a method of three-dimensional (3D) printing a 3D printed object. The method comprises: selectively applying a magnetic marking agent onto powder bed material, wherein the powder bed material comprises polymer particles, and wherein the magnetic marking agent comprises magnetic nanoparticles and a liquid carrier; selectively fusing the powder bed material, such that the magnetic nanoparticles are incorporated in the 3D printed object in a predetermined arrangement that forms a detectable marker in the 3D printed object.
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公开(公告)号:US20220362850A1
公开(公告)日:2022-11-17
申请号:US17637481
申请日:2020-01-29
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: John Samuel Dilip Jangam , Thomas Craig Anthony , Kristopher Erickson , Lihua Zhao
Abstract: The present disclosure relates to a method of three-dimensional (3D) printing a 3D printed object. The method comprises: selectively jetting a marking agent onto a first region of build material, wherein the build material comprises at least one meta and/or ceramic; selectively jetting a binding agent onto at least a portion of the build material; and binding the build material to form a layer; such that the marking agent is incorporated in the metal part in a predetermined arrangement that forms a detectable marker in the 3D printed object. The disclosure also relates to a multi-fluid inkjet kit for 3D printing.
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