公开(公告)号：US20130315468A1

公开(公告)日：2013-11-28

申请号：US13959384

申请日：2013-08-05

Applicant: Hitachi High-Technologies Corporation

Inventor： Yasutaka TOYODA ,  Hideo SAKAI ,  Ryoichi MATSUOKA

IPC: G06T7/00

CPC classification number: G06K9/00 ,  G01R31/31813 ,  G06K9/6255 ,  G06T7/001 ,  G06T2207/30141

Abstract: Although there has been a method for evaluating pattern shapes of electronic devices by using, as a reference pattern, design data or a non-defective pattern, the conventional method has a problem that the pattern shape cannot be evaluated with high accuracy because of the difficulty in defining an exact shape suitable for the manufacturing conditions of the electronic devices. The present invention provides a shape evaluation method for circuit patterns of electronic devices, the method including a means for generating contour distribution data of at least two circuit patterns from contour data sets on the circuit patterns; a means for generating a reference pattern used for the pattern shape evaluation, from the contour distribution data; and a means for evaluating the pattern shape by comparing each evaluation target pattern with the reference pattern.

公开(公告)号：US20130117723A1

公开(公告)日：2013-05-09

申请号：US13712611

申请日：2012-12-12

Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATION

Inventor： Yasutaka TOYODA ,  Ryoichi MATSUOKA ,  Akiyuki SUGIYAMA

IPC: G06F17/50

CPC classification number: G06F17/5081 ,  G06K9/00 ,  G06K2209/19 ,  G06T7/0004

Abstract: A pattern shape evaluation method and semiconductor inspection system having a unit for extracting contour data of a pattern from an image obtained by photographing a semiconductor pattern, a unit for generating pattern direction data from design data of the semiconductor pattern, and a unit for detecting a defect of a pattern, through comparison between pattern direction data obtained from the contour data and pattern direction data generated from the design data corresponding to a pattern position of the contour data.