公开(公告)号：US11324110B2

公开(公告)日：2022-05-03

申请号：US16860965

申请日：2020-04-28

Applicant: HONEYWELL INTERNATIONAL INC.

Inventor： NSV Sarveswara Sarma A ,  Saravanakumar Mahalingam ,  Rama Kumar Mayil ,  Ravi Anekal Radhakrishnan

IPC: H05K1/02 ,  H05K7/14

Abstract: A temperature-variable standoff includes a temperature-variable electrical element. The standoff also includes a support body that supports the temperature-variable electrical element and that is configured to support a circuit board separated at a distance from another component of an electronics assembly. The support body is configured to attach to the circuit board and to project away from the circuit board with a first end proximate the circuit board and a second end spaced away from the circuit board. The standoff further includes an electrical connector supported proximate the first end. The electrical connector is configured to electrically connect within an electrical circuit of the circuit board to provide the electrical input to the temperature-variable electrical element for selectively varying the temperature thereof.

公开(公告)号：US20210282259A1

公开(公告)日：2021-09-09

申请号：US16860965

申请日：2020-04-28

Applicant: HONEYWELL INTERNATIONAL INC.

Inventor： NSV Sarveswara Sarma A ,  Saravanakumar Mahalingam ,  Rama Kumar Mayil ,  Ravi Anekal Radhakrishnan

IPC: H05K1/02

Abstract: A temperature-variable standoff includes a temperature-variable electrical element. The standoff also includes a support body that supports the temperature-variable electrical element and that is configured to support a circuit board separated at a distance from another component of an electronics assembly. The support body is configured to attach to the circuit board and to project away from the circuit board with a first end proximate the circuit board and a second end spaced away from the circuit board. The standoff further includes an electrical connector supported proximate the first end. The electrical connector is configured to electrically connect within an electrical circuit of the circuit board to provide the electrical input to the temperature-variable electrical element for selectively varying the temperature thereof.

公开(公告)号：US10806054B1

公开(公告)日：2020-10-13

申请号：US16533234

申请日：2019-08-06

Applicant: HONEYWELL INTERNATIONAL INC.

Inventor： Saravanakumar Mahalingam ,  NSV Sarveswara Sarma A ,  D Chandra Mohan Vyas ,  Ravi Radhakrishnan ,  Mathews Kuriakose

IPC: H05K7/20 ,  H05K7/14 ,  H05K1/02 ,  H05K1/18

Abstract: An electronic subassembly includes an enclosure, a circuit board, a plurality of electronic components, and a plurality of flexible elastic thermal elements. Each flexible elastic thermal bridge is disposed in the gap between a different one of the electronic components and a first wall of the enclosure. Each flexible elastic thermal bridge includes a first thermally conductive metallic structure, a second thermally conductive metal structure, and an elastically deflectable thermal element. The first thermally conductive metallic structure contacts the first wall. The second thermally conductive metallic structure contacts the top surface of the electronic component and is spaced apart from the first thermally conductive metallic structure to define a void. The elastically deflectable thermal element is disposed in the void and directly contacts both the first thermally conductive metallic structure and the second thermally conductive metallic structure. The elastically deflectable thermal element comprises at least one thermally conductive material.