公开(公告)号：US20250118617A1

公开(公告)日：2025-04-10

申请号：US18988140

申请日：2024-12-19

Applicant: HUAWEI DIGITAL POWER TECHNOLOGIES CO., LTD.

Inventor： Huibin CHEN ,  Jiyang LI ,  Heng WANG

IPC: H01L23/367 ,  H01L21/48 ,  H01L23/00 ,  H01L23/31 ,  H01L23/373 ,  H01L23/498 ,  H01L23/538 ,  H01L25/07

Abstract: A power module includes a first substrate, a second substrate, a first heat sink, a second heat sink, and a chip that are disposed opposite to each other. The chip is disposed between the first heat sink and the second heat sink that are disposed opposite to each other. The first heat sink and the second heat sink are connected to the chip through sintering or welding. The first substrate and the second substrate are respectively connected to the first heat sink and the second heat sink through welding or sintering.

公开(公告)号：US20240354482A1

公开(公告)日：2024-10-24

申请号：US18751817

申请日：2024-06-24

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Wuhua LI ,  Yu ZHOU ,  Haoze LUO ,  Sheng ZHENG ,  Sizhan ZHOU ,  Huibin CHEN

IPC: G06F30/392 ,  G06F30/323 ,  G06F111/02

CPC classification number: G06F30/392 ,  G06F30/323 ,  G06F2111/02

Abstract: In the field of power module technologies, a method and an apparatus for designing a substrate of a power module and a terminal device may be provided. The method includes: obtaining input parameters for designing the substrate of the power module; determining types of basic layout units and a quantity of basic layout units of each type in a circuit topology based on information about the circuit topology and a prestored diagram of a structure of each type of basic layout unit; and connecting, by using a pathfinding model, a connection path of graph elements of each basic layout unit in the circuit topology, to obtain a connection diagram of the substrate of the power module.