公开(公告)号：US20220087050A1

公开(公告)日：2022-03-17

申请号：US17538881

申请日：2021-11-30

Applicant: HUAWEI TECHNOLOGIES CO.,LTD.

Inventor： Hui Jia ,  Jiyang Li ,  Chao Wang

IPC: H05K7/20

Abstract: A heat dissipation apparatus is provided. The heat dissipation apparatus includes an immersion tank. The immersion tank accommodates a liquid medium. When being used, the board is immersed in the liquid medium, and the liquid medium dissipates heat for the board by absorbing heat. The heat dissipation apparatus further includes a condenser immersed in the liquid medium. The condenser is disposed to dissipate heat for the liquid medium. Heat of the board is transferred to the condenser in the immersion tank by using the liquid medium in the immersion tank as a medium. Then the condenser takes away and dissipates the heat by using a cooling apparatus that is connected to the condenser and that is configured to perform heat exchange for the condenser.

公开(公告)号：US20240164053A1

公开(公告)日：2024-05-16

申请号：US18422847

申请日：2024-01-25

Applicant: Huawei Technologies Co., Ltd.

Inventor： Jianliang Wang ,  Dzmitry Kushner ,  Jiyang Li ,  Shuqin Xie ,  Along Zhou ,  Jian Shi ,  Shoubiao Xu

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20254 ,  G06F1/203 ,  H05K7/20263

Abstract: A liquid cooling plate includes a housing, a support structure, and a coolant. The housing includes a top wall and a bottom wall, the top wall and the bottom wall are covered to form an accommodation cavity, and the accommodation cavity includes a first region and a second region. The support structure is disposed in the first region and is located between the top wall and the bottom wall. The coolant flows in the accommodation cavity to dissipate heat from a heat generating device, the coolant can expand in volume when being heated and shrink in volume when being cooled, and the second region can deform to absorb a volume variation of the coolant.